Abstract: Dry pumps are used to pump a variety of gas mixtures from the semiconductor industry. The present invention provides a liquid ring pump located between the dry pump and an abatement device to remove soluble corrosive materials prior to the exhaust gases entry to the abatement device, the work fluid exhausted from the liquid ring pump being separated from the gas prior to entry to the abatement device.

Abstract: In situations where a vacuum system is suddenly overloaded, there is a risk of mechanical damage being sustained, for example, bearing damage, gear slippage or rotor and/or stator collisions. Sudden overloads can also lead to electrical damage, for example, over-currents or power surges. Therefore a pressure regulating apparatus is provided for use in a vacuum pumping system having an inlet, an outlet and a conduit interposed between, and in fluid communication with, the inlet and the outlet, wherein the cross-sectional area of the conduit is greater than that required to meet the conductance requirements of the inlet and the outlet.

Abstract: Dry pumps are used to pump a variety of gas mixtures from the semiconductor industry. The present invention provides a liquid ring pump located between the dry pump and an abatement device to remove soluble corrosive materials prior to the exhaust gases entry to the abatement device, the work fluid exhausted from the liquid ring pump being separated from the gas prior to entry to the abatement device.

Abstract: A vacuum pumping arrangement includes a first primary pump having an inlet and an outlet, and a first common pumping line fluidly connected to the inlet, the first common pumping line including a plurality of first common pumping line inlets each of which is fluidly connectable to at least one vacuum process chamber forming the semiconductor fabrication tool, the first primary pump and the first common pumping line handling deposition process flows. The pumping arrangement further including a second primary pump having an inlet and an outlet, and a second common pumping line fluidly connected to the inlet of the second primary pump, the second common pumping line including a plurality of second pumping line inlets each of which is fluidly connectable to at least one process chamber forming the semiconductor fabrication tool, the second primary pump and the second common pumping line handling cleaning process flows.

Abstract: In situations where a vacuum system is suddenly overloaded, there is a risk of mechanical damage being sustained, for example, bearing damage, gear slippage or rotor and/or stator collisions. Sudden overloads can also lead to electrical damage, for example, over-currents or power surges. Therefore a pressure regulating apparatus is provided for use in a vacuum pumping system having an inlet, an outlet and a conduit interposed between, and in fluid communication with, the inlet and the outlet, wherein the cross-sectional area of the conduit is greater than that required to meet the conductance requirements of the inlet and the outlet.

Abstract: A method for adjusting operating parameters of a vacuum pump arrangement includes determining characteristics of a gas flowing through the vacuum pump arrangement; and setting operating parameters of the vacuum pump arrangement based on the determined characteristics of the first gas. A controller can be configured to perform the method for adjusting the operating parameters of the vacuum pump arrangement in accordance with the characteristics of the gas.

Abstract: A pair of Northey rotors for a vacuum pump, in which each rotor comprises two opposing, substantially parallel faces, and a peripheral surface located between the opposing faces. In order to reduce damage caused by pumping a gas stream containing liquid or solid particulates, a plurality of grooves is located on the peripheral surface for accommodating the particulates.

Abstract: A method for warming up a vacuum pump arrangement having a booster pump and a backing pump downstream of the booster pump for evacuating a process chamber includes setting the booster pump at a first speed higher than an idle speed of the booster pump when the same is in an idle mode; and controlling a backing pressure at an outlet of the booster pump within a range from 0.1 mbar to 10 mbar at least for a period of time from when the vacuum pump arrangement is activated from the idle mode to when the booster pump reaches a temperature equal to or exceeding a first predetermined threshold value. Such method is implemented in system where a controlled is configured to carry out the above-motioned actions.

Abstract: The present invention relates to a multi-stage vacuum pump which has a plurality of pumping stages. The pump comprises a stator forming the pumping chambers of respective pumping stages and at least one shaft, for supporting a plurality of rotors for rotation in respective pumping chambers. The stator comprises: a stator envelope which extends over an axial extent of a plurality of stator stages thereby circumscribing said at least one shaft and forming an internal profile of a plurality of stator stages: and a plurality of transverse walls located on either axial side of the stator stages to form respective said pumping chambers. At least one of the transverse walls is an inter-stage between stator stages and the stator envelope is configured to circumscribe the inter-stage for location of said inter-stage radially inward of the stator part.

Abstract: A pair of Northey rotors for a vacuum pump, in which each rotor comprises two opposing, substantially parallel faces, and a peripheral surface located between the opposing faces. In order to reduce damage caused by pumping a gas stream containing liquid or solid particulates, a plurality of grooves is located on the peripheral surface for accommodating the particulates.