Patents by Inventor Jack S. Kasahara

Jack S. Kasahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices
    Patent number: 6838115
    Abstract: Single wafer processing methods and systems for manufacturing films having low-k properties and low indices of refraction. The methods incorporate a processing station in which both curing and post-cure, in situ gas cooling take place.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: January 4, 2005
    Assignee: FSI International, Inc.
    Inventors: Devendra Kumar, Jeffrey D. Womack, Vuong P. Nguyen, Jack S. Kasahara, Sokol Ibrani
  • Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices
    Publication number: 20040047993
    Abstract: Single wafer processing methods and systems for manufacturing films having low-k properties and low indices of refraction. The methods incorporate a processing station in which both curing and post-cure, in situ gas cooling take place.
    Type: Application
    Filed: September 5, 2003
    Publication date: March 11, 2004
    Inventors: Devendra Kumar, Jeffrey D. Womack, Vuong P. Nguyen, Jack S. Kasahara, Sokol Ibrani
  • Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices
    Publication number: 20020132052
    Abstract: Single wafer processing methods and systems for manufacturing films having low-k properties and low indices of refraction. The methods incorporate a processing station in which both curing and post-cure, in situ gas cooling take place.
    Type: Application
    Filed: July 11, 2001
    Publication date: September 19, 2002
    Inventors: Devendra Kumar, Jeffrey D. Womack, Vuong P. Nguyen, Jack S. Kasahara, Sokol Ibrani
  • Thermal processing chamber for heating and cooling wafer-like objects
    Patent number: 6423947
    Abstract: A processing chamber and methods for employing this processing chamber to thermally treat wafer-like objects. The chamber comprises a double walled shell, a pedestal style heater, internal passages for the transport of cooling gases and removal of exhaust gases, independently variable gas introduction patterns, and a movable door for sealing the chamber. The chamber is designed to permit in situ cooling of wafer-like objects and to provide means for precise optimization of this cooling. The methods provide for the processing of the wafer-like object in an environment where the temperature, rate of change of the temperature, composition of gases and the relative timings of changes to these variables may be controlled to achieve the desired material properties in the wafer-like object or in films contained on this wafer-like object.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: July 23, 2002
    Assignee: FSI International, Inc.
    Inventors: Jeffrey D. Womack, Vuong P. Nguyen, Devendra Kumar, Jack S. Kasahara, Sokol Ibrani
  • Thermal processing chamber for heating and cooling wafer-like objects
    Publication number: 20010040155
    Abstract: A processing chamber and methods for employing this processing chamber to thermally treat wafer-like objects. The chamber comprises a double walled shell, a pedestal style heater, internal passages for the transport of cooling gases and removal of exhaust gases, independently variable gas introduction patterns, and a movable door for sealing the chamber. The chamber is designed to permit in situ cooling of wafer-like objects and to provide means for precise optimization of this cooling. The methods provide for the processing of the wafer-like object in an environment where the temperature, rate of change of the temperature, composition of gases and the relative timings of changes to these variables may be controlled to achieve the desired material properties in the wafer-like object or in films contained on this wafer-like object.
    Type: Application
    Filed: June 29, 2001
    Publication date: November 15, 2001
    Applicant: FSI International Inc.
    Inventors: Jeffrey D. Womack, Vuong P. Nguyen, Devendra Kumar, Jack S. Kasahara, Sokol Ibrani
  • Thermal processing chamber for heating and cooling wafer-like objects
    Patent number: 6307184
    Abstract: A processing chamber and methods for employing this processing chamber to thermally treat wafer-like objects. The chamber comprises a double walled shell, a pedestal style heater, internal passages for the transport of cooling gases and removal of exhaust gases, independently variable gas introduction patterns, and a movable door for sealing the chamber. The chamber is designed to permit in situ cooling of wafer-like objects and to provide means for precise optimization of this cooling. The methods provide for the processing of the wafer-like object in an environment where the temperature, rate of change of the temperature, composition of gases and the relative timings of changes to these variables may be controlled to achieve the desired material properties in the wafer-like object or in films contained on this wafer-like object.
    Type: Grant
    Filed: July 12, 1999
    Date of Patent: October 23, 2001
    Assignee: FSI International, Inc.
    Inventors: Jeffrey D. Womack, Vuong P. Nguyen, Devendra Kumar, Jack S. Kasahara, Sokol Ibrani