Patents by Inventor Jack S. Rechtin

Jack S. Rechtin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure-compensated thermal energy storage module
    Patent number: 11808526
    Abstract: A thermal energy storage system including an enclosure having an internal volume. An incompressible phase change material (PCM) is provided within the internal volume of the enclosure, where the PCM contracts into a solid state when its temperature falls below a certain temperature and expands into a liquid state when its temperature goes above the certain temperature. An elastic bladder is positioned adjacent to the PCM within the internal volume of the enclosure and is filled with a compressible material, where the PCM pushes against the bladder when it is expanded to the liquid state and causes the compressible material to be compressed within the bladder and the enclosure.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: November 7, 2023
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Michael T. Barako, Juan C. Garcia, Jack S Rechtin, Nadine Y. Kawabata
  • PRESSURE-COMPENSATED THERMAL ENERGY STORAGE MODULE
    Publication number: 20220357112
    Abstract: A thermal energy storage system including an enclosure having an internal volume. An incompressible phase change material (PCM) is provided within the internal volume of the enclosure, where the PCM contracts into a solid state when its temperature falls below a certain temperature and expands into a liquid state when its temperature goes above the certain temperature. An elastic bladder is positioned adjacent to the PCM within the internal volume of the enclosure and is filled with a compressible material, where the PCM pushes against the bladder when it is expanded to the liquid state and causes the compressible material to be compressed within the bladder and the enclosure.
    Type: Application
    Filed: May 6, 2021
    Publication date: November 10, 2022
    Inventors: Michael T. Barako, Juan C. Garcia, Jack S. Rechtin, Nadine Y. Kawabata