Abstract: A technology is described for a Photonic Integrated Circuit (PIC) radio frequency (RF) oscillator. The PIC RF oscillator can comprise an optical gain media coupled to a first mirror and configured to be coupled to the PIC. The PIC can comprise a first optical cavity located within the PIC, a tunable mirror to form a first optical path between the first mirror in the gain media and the first tunable mirror, and a frequency tunable intra-cavity dual tone resonator positioned within the first optical cavity to constrain the first optical cavity having a common optical path to produce tow primary laser tones with a tunable frequency spacing. A photo detector is optically coupled to the PIC and configured to mix the two primary laser tones to form an RF output signal with a frequency selected by the tunable frequency spacing of the two primary tones.

Abstract: Embodiments herein relate to a fully integrated broadband interconnect. The system comprises a first integrated circuit, a second integrated circuit, and a coupler structure to connect the first and second integrated circuits, where the coupler structure includes a base portion and a top portion that are connected by two vertical walls. The top portion has a gap that increases a strength of a transverse electric field across the gap when the coupler structure is operating in an odd higher order mode that is horizontally polarized, where the coupler structure is full of a dielectric material, and where the cross-sectional width of the coupler structure is tapered in a direction of wave propagation. The system further comprises a dielectric waveguide attached to the top portion of the coupler structure, where the dielectric waveguide supports the odd higher order mode and an even higher order mode.

Abstract: Embodiments herein relate to a fully integrated broadband interconnect. The system comprises a first integrated circuit, a second integrated circuit, and a coupler structure to connect the first and second integrated circuits, where the coupler structure includes a base portion and a top portion that are connected by two vertical walls. The top portion has a gap that increases a strength of a transverse electric field across the gap when the coupler structure is operating in an odd higher order mode that is horizontally polarized, where the coupler structure is full of a dielectric material, and where the cross-sectional width of the coupler structure is tapered in a direction of wave propagation. The system further comprises a dielectric waveguide attached to the top portion of the coupler structure, where the dielectric waveguide supports the odd higher order mode and an even higher order mode.

Abstract: A coupling ring is bonded onto the opposite ends of a ferroelectric stack ving substantially the same thermal expansion coefficient as the stack. A thin film of silicone compound is wiped onto the axially exposed surfaces of the rings and surfaces provided in a head and a tail mass are configured to mate with them. A plurality of microspheres are mixed uniformly through a liquid adhesive and this mixture is coated onto the suitably shaped surfaces on the head and tail mass. A stress rod reaching between the head and tail mass axially compresses the ferroelectric stack and excess adhesive mixture is squeezed from between the mating surfaces. The thickness of the liquid adhesive is restricted to the diameter of the microspheres to ensure a high impedance match and upon applying the proper amount of heat, rigid joints are set up between the now hardened adhesive and the head and tail mass.

Abstract: A coupling ring is bonded onto the opposite ends of a ferroelectric stack ving substantially the same thermal expansion coefficient as the stack. A thin film of silicone compound is wiped onto the axially exposed surfaces of the rings and surfaces provided in a head and a tail mass are configured to mate with them. A plurality of microspheres are mixed uniformly through a liquid adhesive and this mixture is coated onto the suitably shaped surfaces on the head and tail mass. A stress rod reaching between the head and tail mass axially compresses the ferroelectric stack and excess adhesive mixture is squeezed from between the mating surfaces. The thickness of the liquid adhesive is restricted to the diameter of the microspheres to ensure a high impedance match and upon applying the proper amount of heat, rigid joints are set up between the now hardened adhesive and the head and tail mass.