Patents by Inventor Jack W. Tseng

Jack W. Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible circuit assembly
    Patent number: 6307751
    Abstract: A completely flexible circuit is disclosed. In one embodiment, the flexible circuit includes a layer of flexible substrate having conductive material deposited on it. The flexible circuit also includes a plurality of components fixedly attached to the flexible substrate, and electrically interconnected by the conductive material. Also, the flexible circuit includes a flexible display screen attached to the at least one layer of flexible substrate and electrically coupled to at least one of the plurality of components.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: October 23, 2001
    Assignee: WearLogic, Inc.
    Inventors: Lawrence A. Bodony, Richard Bryan, Jack W. Tseng