Patents by Inventor Jack Winter

Jack Winter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to mechanically isolate and electrically couple between a phased array transmit/receive board
    Patent number: 12621012
    Abstract: Methods, systems, and apparatuses for mechanically isolating and electrically coupling a transmit/receive board with one or more antennae are provided. For example, a transmit/received board may be mechanically isolated and electrically coupled to a 3D printed phased array antenna. The electrical coupling may be with a plurality of couplers. A first coupler may be associated with the transmit/receive board and a second coupler may be associated with the antenna. Near-field coupling of the first coupler and second coupler allow for a signal to be transmitted and received without mechanical coupling.
    Type: Grant
    Filed: March 28, 2023
    Date of Patent: May 5, 2026
    Assignee: CAES Systems LLC
    Inventors: Jack Winter, Dean Pizio, Michael Simon