Abstract: The present invention relates generally to a deposition apparatus for semiconductor processing. More specifically, embodiments of the present invention relate to a gas manifold valve cluster and deposition apparatus. In some embodiments of the present invention a gas manifold valve cluster and system are provided that promotes reduced length and volumes of gas lines that will be exposed to atmosphere during cleaning which minimizes the time required to perform process chamber maintenance and therefore increase the productivity of the process chamber. In other embodiments a gas manifold valve cluster and ALD deposition apparatus are provided.

Abstract: The present invention relates generally to a deposition apparatus for semiconductor processing. More specifically, embodiments of the present invention relate to a deposition apparatus having a reduced reaction zone volume. In some embodiments a deposition apparatus is provided with a process chamber having a raised reaction zone. Other embodiments of the present invention provide a deposition apparatus with a process chamber having a vertical baffle ring. Embodiments of the present invention provide a reduced reaction zone or volume which promotes uniform gas flow pattern and faster gas exchange.

Abstract: The present invention provides a gas distribution apparatus useful in semiconductor manufacturing. The gas distribution apparatus comprises a unitary member and a gas distribution network formed within the unitary member for uniformly delivering a gas into a process region. The gas distribution network is formed of an inlet passage extending upwardly through the upper surface of the unitary member for connecting to a gas source, a plurality of first passages converged at a junction and connected with the inlet passage at the junction, a plurality of second passages connected with the plurality of first passages, and a plurality of outlet passages connected with the plurality of second passages for delivering the gas into a processing region. The first passages extend radially and outwardly from the junction to the periphery surface of the unitary member, and the second passages are non-perpendicular to the first passages and extend outwardly from the first passages to the periphery surface.

Abstract: The present invention provides a gas distribution apparatus comprising a plurality of outlets and at least one replaceable insert placed in at least one of the outlets. The insert is provided with a passageway adapted to alter the size of the at least one of the outlets and/or the direction of gases exiting the at least one of the outlets. The insert is provided with passageway that may be substantial straight and cylindrical. The passageway may have a first portion with a smaller diameter and a second portion with a larger diameter to selectively alter the size of the outlet passage in the gas distribution apparatus. Alternatively, the insert is provided with a main passageway and plurality of secondary passageways branched and angled from the main passageway. The angle between the main and branch passageways is in the range from about 10 to about 90 degrees. In one embodiment, the angle between the main and branch passageways is about 90 degrees.

Abstract: In the present invention, setting apparatus for semiconductor equipment with multitude of chambers comprises a plurality of input devices coupled to a controlling system of the semiconductor equipment. The input devices are used for setting a maintain status of said chambers whereby said chambers can be available for a test process. A method for setting a plurality of statuses for a plurality of chambers in semiconductor equipment comprises setting a plurality of maintain statuses for the chambers and executing a plurality of test process in the chambers in the maintain statuses. To be specific, the setting step can simultaneously set an on-line status for each the chamber and the maintain status for other the chamber.

Abstract: In the present invention, setting apparatus for semiconductor equipment with multitude of chambers comprises a plurality of input devices coupled to a controlling system of the semiconductor equipment. The input devices are used for setting a maintain status of said chambers whereby said chambers can be available for a test process. A method for setting a plurality of statuses for a plurality of chambers in semiconductor equipment comprises setting a plurality of maintain statuses for the chambers and executing a plurality of test process in the chambers in the maintain statuses. To be specific, the setting step can simultaneously set an on-line status for each the chamber and the maintain status for other the chamber.

Abstract: A method for removing extraneous matters from a stainless device is provided. The method includes the steps of (a) providing a container for holding a fluorine-containing neutral solution therein, (b) immersing said stainless device in said fluorine-containing neutral solution to remove said extraneous matters from said stainless device, and (c) heating and swirling said fluorine-containing solution. The fluorine-containing neutral solution is made from neutralizing hydrofluoric acid (HF) with ammonium hydroxide (NH4OH), neutralizing hydrofluoric acid (HF) with ammonium fluoride (NH4F), or dissolving ammonium acid fluoride (NH4F) in a deionized water (DIW).