Abstract: A wafer inspection tool for determining the cause of broken wafer edges. The wafer inspection tool comprises a circular transparent plate having a profile similar to a wafer. The circular transparent plate further includes a wafer edge notch for aligning with a wafer and a plurality of clamp pin notches showing wafer clamp pin positions of a particular sputtering chamber. The wafer inspection tool is placed on a sputtering chamber in an easily accessible, one for each sputtering chamber. When broken edges are found on a wafer, the cause of the broken wafer can be traced back by overlaying the broken wafer on the transparent plate with their respective wafer edge notches aligned together. Then, the positions of broken edges are compared with the clamp pin notches on the tool. If broken edges of the wafer match the clamp pin notch positions of a particular chamber, the particular chamber that causes the broken edges is found.