Patents by Inventor Jackie A. Walter

Jackie A. Walter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for providing an improved electroplated tape automated bonding tape and the product produced thereby
    Patent number: 4806409
    Abstract: A flexible tape having a desired metal foil circuit pattern and a process for manufacturing such a tape. The starting tape comprises a non-metallic flexible substrate having a metal foil layer adhered thereto. The foil layer is patterned to form a desired circuit pattern and a pattern comprising bussing means. The foil is electroplated by connection of the electroplating circuitry to the bussing means. Thereafter, the tape is reduced in width by removing the bussing means and the underlying flexible substrate.
    Type: Grant
    Filed: May 20, 1987
    Date of Patent: February 21, 1989
    Assignee: Olin Corporation
    Inventors: Jackie A. Walter, Brett Sharenow, Robert Walker, Scott V. Voss
  • Interconnect tape for use in tape automated bonding
    Patent number: 4721993
    Abstract: An improved interconnect tape for use in tape automated bonding comprising a carrier member for supporting at least one pattern of interconnect leads. At least one first ring is provided having a plurality of sides with each of the sides supporting the leads extending inwardly of the member. Yieldable portions connecting the ring to the carrier member provide reduced stresses in the leads and reduced thermal dissipation during inner lead bonding.
    Type: Grant
    Filed: January 31, 1986
    Date of Patent: January 26, 1988
    Assignee: Olin Corporation
    Inventor: Jackie A. Walter