Patents by Inventor Jackie C. Preciado

Jackie C. Preciado has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bridge die design for high bandwidth memory interface
    Patent number: 11094633
    Abstract: A microelectronic package bridge can comprising a plurality of ground layers, and a plurality of signal layers interwoven with the plurality of ground layers. Each of the signal layers can include a plurality of electrically conductive pathways. Each of the electrically conductive pathways can be arranged to form an electrical connection between one of a first plurality of bumps of a first die and one of a second plurality of bumps of a second die. Each of the plurality of electrically conductive pathways can have a length substantially equal to one another.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: August 17, 2021
    Assignee: Intel Corporation
    Inventors: Zhiguo Qian, Kemal Aygun, Dae-Woo Kim, Jackie C. Preciado
  • BRIDGE DIE DESIGN FOR HIGH BANDWIDTH MEMORY INTERFACE
    Publication number: 20190229056
    Abstract: A microelectronic package bridge can comprising a plurality of ground layers, and a plurality of signal layers interwoven with the plurality of ground layers. Each of the signal layers can include a plurality of electrically conductive pathways. Each of the electrically conductive pathways can be arranged to form an electrical connection between one of a first plurality of bumps of a first die and one of a second plurality of bumps of a second die. Each of the plurality of electrically conductive pathways can have a length substantially equal to one another.
    Type: Application
    Filed: June 30, 2016
    Publication date: July 25, 2019
    Inventors: Zhiguo Qian, Kemal Aygun, Dae-Woo Kim, Jackie C. Preciado