Abstract: A tape ball grid array package and a method of fabricating the package. A dielectric tape having a metallic layer on both sides is provided. The metallic layers are patterned to form circuits. A plurality of via holes is formed in the dielectric tape. The via holes pass through the lower metallic layer and the tape dielectric but stop at the upper metallic layer, thereby forming a plurality of blind holes. A solder mask layer is formed over each side of the tape and the solder mask layers are patterned to expose a portion of the metallic layer serving as contact points for connecting with a chip. A solder ball is inserted into each blind hole. One end of the solder ball protrudes from the surface of the solder mask layer. Wire-bonding operation or flip-chip assembly process is conducted to form electrical connection between the chip and the contact points.

Abstract: The invention provides a pin-typed electric connection device, which provides an electric connection with a circuit board having a circuit layout and several electronic elements. The pin-typed electric connection device includes: a base seat, a gliding seat, and an actuating mechanism. The base seat makes an electric connection with the circuit board. On the top surface of the base seat, there is one blocking-and-fixing portion. The gliding seat is placed on the top surface side of the base seat by a relatively gliding manner. There is one insetting-and-placing portion at an appropriate position of the gliding seat in corresponding to the blocking-and-fixing portion. The actuating mechanism is brought along with the blocking-and-fixing portion and the insetting-and-placing portion. The gliding seat is driven by the actuating mechanism to proceed an appropriately linear gliding displacement.

Abstract: A tape ball grid array package and a method of fabricating the package. A dielectric tape having a metallic layer on both sides is provided. The metallic layers are patterned to form circuits. A plurality of via holes is formed in the dielectric tape. The via holes pass through the lower metallic layer and the tape dielectric but stop at the upper metallic layer, thereby forming a plurality of blind holes. A solder mask layer is formed over each side of the tape and the solder mask layers are patterned to expose a portion of the metallic layer serving as contact points for connecting with a chip. A solder ball is inserted into each blind hole. One end of the solder ball protrudes from the surface of the solder mask layer. Wire-bonding operation or flip-chip assembly process is conducted to form electrical connection between the chip and the contact points.

Abstract: An improved structure of a ball-grid array (BGA) package substrate and processes for producing thereof are disclosed, wherein one side of the BGA substrate has a single pattern layer for connecting with solder balls and a heat sink layer is bonded to the other side of the substrate. The heat sink layer provides not only heat dissipation for the substrate, but also patterns for power and/or for ground, so as to diminish the dimension required for the patterns for power and/or for ground on the pattern layer of the substrate. The solder balls for power and/or for ground of the substrate are connected with the heat sink layer through electrically and thermally conductive via holes plugged with conductive paste.

Abstract: An improved structure of a ball-grid array (BGA) package substrate and processes for producing thereof are disclosed, wherein one side of the BGA substrate has a single pattern layer for connecting with solder balls and a heat sink layer is bonded to the other side of the substrate. The heat sink layer provides not only heat dissipation for the substrate, but also patterns for power and/or for ground, so as to diminish the dimension required for the patterns for power and/or for ground on the pattern layer of the substrate. The solder balls for power and/or for ground of the substrate are connected with the heat sink layer through electrically and thermally conductive via holes plugged with conductive paste.