Patents by Inventor Jackie Lin

Jackie Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipating device adapted to be applied to a flip chip device
    Patent number: 6487077
    Abstract: In a heat dissipating device, a heat-conductive base plate is mounted on a flip chip base, and is formed with a through hole that extends from an upper surface to a lower surface opposite to the lower surface and disposed in contact with the flip chip base. A heat-conductive block is formed integrally on the upper surface of the base plate, covers the through hole in the base plate, and has a bottom surface flush with the upper surface of the base plate. The bottom surface is formed with a recess that is registered with the through hole in the base plate such that when the base plate is used to cover the flip chip base, the through hole in the base plate allows the chip device to extend into the recess. Multiple heat-dissipating members are formed integrally on the upper surface of the base plate.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: November 26, 2002
    Assignee: Advanced Thermal Technologies
    Inventor: Jackie Lin
  • Knob
    Patent number: D1122067
    Type: Grant
    Filed: March 28, 2025
    Date of Patent: April 14, 2026
    Assignee: JIAXING SUNSTONE METAL PRODUCTS CO.LTD.
    Inventors: Jackie Lin, Eric Xu