Patents by Inventor Jackson C. S. Lai

Jackson C. S. Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High fill-factor sensor with reduced coupling
    Patent number: 7615731
    Abstract: A photosensor array includes data and scan lines (124, 148), circuitry of each data line/scan line pair formed in a backplane (110) on a substrate (102). On a first electrode scan line (148) a switching element (112) responds to a scan signal, connecting a first terminal (106) to a second terminal (108). A front plane (120) has sensing elements (122) indicating a measure of a received stimulus and including a charge collection electrode (130). An insulating layer (140) disposed between the backplane (110) and the front plane (120) contains at least a first via (136) connecting the first terminal (108) of the switching element (112) in the backplane (110) to a charge collection electrode (130) of the sensing element (122) in the front plane (120). A second via (126) connects between the second terminal (108) of the switching element (112) and the data line (124).
    Type: Grant
    Filed: September 14, 2006
    Date of Patent: November 10, 2009
    Assignee: Carestream Health, Inc.
    Inventors: Gregory N. Heiler, Timothy J. Tredwell, Mark D. Bedzyk, Roger S. Kerr, Yuriy Vygranenko, Denis Striakhilev, Yongtaek Hong, Jackson C. S. Lai, Arokia Nathan
  • HIGH FILL-FACTOR SENSOR WITH REDUCED COUPLING
    Publication number: 20080067324
    Abstract: A photosensor array includes data and scan lines (124, 148), circuitry of each data line/scan line pair formed in a backplane (110) on a substrate (102). On a first electrode scan line (148) a switching element (112) responds to a scan signal, connecting a first terminal (106) to a second terminal (108). A front plane (120) has sensing elements (122) indicating a measure of a received stimulus and including a charge collection electrode (130). An insulating layer (140) disposed between the backplane (110) and the front plane (120) contains at least a first via (136) connecting the first terminal (108) of the switching element (112) in the backplane (110) to a charge collection electrode (130) of the sensing element (122) in the front plane (120). A second via (126) connects between the second terminal (108) of the switching element (112) and the data line (124).
    Type: Application
    Filed: September 14, 2006
    Publication date: March 20, 2008
    Inventors: Gregory N. Heiler, Timothy J. Tredwell, Mark D. Bedzyk, Roger S. Kerr, Yuriy Vygranenko, Denis Striakhilev, Yongtaek Hong, Jackson C. S. Lai, Arokia Nathan