Abstract: Disclosed herein is a light transmissive fiber integrated knit textile for use on consumer electronic products. The knit textile is depicted to be constructed with light transmissive fibers integration through a weave-in/inlay knit technique with a flat-bed knitting construction. The light transmissive knitted textile is also tethered to a portable electronic device, allowing for the light transmitting fibers knitted into the fabric to define a lighting display on said fabric.

Abstract: A system for resizing image files includes an FPGA including an interface controller operable to receive a plurality of image files through an interface, a computing kernel controller, and a memory controller. The FPGA also includes an interconnect coupled to the computing kernel controller and the memory controller and a plurality of computing kernels coupled to the interconnect. The system also includes a memory coupled to the FPGA.

Abstract: A system for resizing image files includes an FPGA including an interface controller operable to receive a plurality of image files through an interface, a computing kernel controller, and a memory controller. The FPGA also includes an interconnect coupled to the computing kernel controller and the memory controller and a plurality of computing kernels coupled to the interconnect. The system also includes a memory coupled to the FPGA.

Abstract: A system for resizing image files includes an FPGA including an interface controller operable to receive a plurality of image files through an interface, a computing kernel controller, and a memory controller. The FPGA also includes an interconnect coupled to the computing kernel controller and the memory controller and a plurality of computing kernels coupled to the interconnect. The system also includes a memory coupled to the FPGA.

Abstract: Cells can include variable volumes defined between a flexible structure, such as a polymer layer, and a support surface, with the flexible structure and support surface being attached in a first region that surrounds a second region in which they are unattached. Various adhesion structures can attach the flexible structure and the support surface. When unstretched, the flexible structure can lie in a flat position on the support surface. In response to a stretching force away from the support surface, the flexible structure can move out of the flat position, providing the variable volume. Electrodes, such as on the flexible structure, on the support surface, and over the flexible structure, can have charge levels that couple with each other and with the variable volume. A support structure can include a device layer with signal circuitry that provides a signal path between an electrode and external circuitry. One or more ducts can provide fluid communication with each cell's variable volume.

Abstract: Various traveling wave grids and related systems are disclosed that are particularly beneficial for the separation, transport, and focusing of biomolecules or other charged species. An implementation of a vertically integrated traveling wave module is described which allows for scalability to arbitrary gel dimensions through tiling. In addition, several unique traveling wave algorithms are also described which when used in conjunction with the traveling wave grids, impart selective motion to biomolecules or other charged species.

Abstract: A backplane circuit includes an array of organic thin-film transistors (OTFTs), each OTFT including a source contact, a drain contact, and an organic semiconductor region extending between the source and drain contacts. The drain contacts in each row are connected to an address line. The source and drain contacts and the address lines are fabricated using a multi-layer structure including a relatively thick base portion formed of a relatively inexpensive metal (e.g., aluminum or copper), and a relatively thin contact layer formed of a high work function, low oxidation metal (e.g., gold) that exhibits good electrical contact to the organic semiconductor, is formed opposite at least one external surface of the base, and is located at least partially in an interface region where the organic semiconductor contacts an underlying dielectric layer.

Abstract: Cells can include variable volumes defined between a flexible structure, such as a polymer layer, and a support surface, with the flexible structure and support surface being attached in a first region that surrounds a second region in which they are unattached. Various adhesion structures can attach the flexible structure and the support surface. When unstretched, the flexible structure can lie in a flat position on the support surface. In response to a stretching force away from the support surface, the flexible structure can move out of the flat position, providing the variable volume. Electrodes, such as on the flexible structure, on the support surface, and over the flexible structure, can have charge levels that couple with each other and with the variable volume. A support structure can include a device layer with signal circuitry that provides a signal path between an electrode and external circuitry. One or more ducts can provide fluid communication with each cell's variable volume.

Abstract: Controlled overetching is utilized to produce metal patterns having gaps that are smaller than the resolution limits of the feature patterning (e.g., photolithography) process utilized to produce the metal patterns. A first metal layer is formed and masked, and exposed regions are etched away. The etching process is allowed to continue in a controlled manner to produced a desired amount of over-etching (i.e., undercutting the mask) such that an edge of the first metal layer is offset from an edge of the mask by a predetermined gap distance. A second metal layer is then deposited such that an edge of the second metal layer is spaced from the first metal layer by the predetermined gap distance. The metal gap is used to define, for example, transistor channel lengths, thereby facilitating the production of transistors having channel lengths defined by etching process control that are smaller than the process resolution limits.

Abstract: Various traveling wave grids and related systems are disclosed that are particularly beneficial for the separation, transport, and focusing of biomolecules or other charged species. An implementation of a vertically integrated traveling wave module is described which allows for scalability to arbitrary gel dimensions through tiling. In addition, several unique traveling wave algorithms are also described which when used in conjunction with the traveling wave grids, impart selective motion to biomolecules or other charged species.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad/via.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad/via.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.

Abstract: Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.

Abstract: A top gate, self-aligned polysilicon (poly-Si) thin film transistor (TFT) is formed using a single laser anneal to crystallize the active silicon and to activate the source-drain region. The poly-Si TFT includes a substrate, dummy gate, a barrier oxide layer, a polysilicon pattern having a source region and a drain region, a gate oxide, and a gate.

Abstract: A micro-electromechanical bistable shutter display device is provided capable of being implemented for both small screen, high resolution devices and for large billboard-type displays. The micro-electromechanical shutter assembly has bi-stability characteristics which allow the use of only a holding voltage to maintain an image. The micro-electromechanical shutter assembly includes a shutter having petal-like shutter segments covering reflective or transmittive films. To expose the film in a particular shutter assembly, its shutter segments are moved from the horizontal to a vertical position using electrostatic attraction forces to “collapse” the torsionally-hinged shutter segments. The shutter assembly can have a number of segments, as long as the resulting shutter assembly shape can be stacked to form a dense 2D array.

Abstract: A liquid crystal display is provided having two substrates. One substrate includes active aperture areas and a non-active area. A spacing layer is provided between the two substrates and includes spacing elements of anisotropic shape and geometry. The anisotropic spacing elements are formed only within the non-active areas of the substrate. A method of manufacturing is also provided including mechanically rubbing the liquid crystal display after the spacing elements are formed on the one substrate.

Abstract: The invention provides an integrated dark matrix for an active matrix liquid crystal display. A plurality of pixel electrodes overlap at least one of a plurality of gate lines and a plurality of data lines. A perimeter of the pixel electrodes overlaps the gate lines and/or data lines by twice the distance that the pixel electrode is above the gate and data lines, respectively to obtain a viewing angle of over 60 degrees.

Abstract: A punching and binding machine, particularly a machine to punch and bind papers at high speed, comprises including a punching unit and a binding unit adapted for independent operation. The punching unit has an upper clamp element and a lower clamp element for use in punching operations and the binding unit incorporates an adjustment mechanism for selecting the use of either an iron binding ring or a plastic binding ring of appropriate diameter for binding of papers of different thicknesses.