Patents by Inventor Jackson Kong

Jackson Kong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vertical trench routing in a substrate
    Patent number: 10079158
    Abstract: An interconnect topology that includes vertical trench routing in a substrate is disclosed. In one embodiment, the interconnect comprises a substrate having a plurality of layers including a first ground plane layer; a pair of signal conductors that form a differential signal pair, each conductor of the pair of signal conductors having a first portion and a second portion, the second portion extending from the first portion into at least one of the plurality of layers, wherein width of the second portion is less than width of the first portion; and wherein the first ground plane layer is only a first partial layer and has a first void region that is closer to the pair of signal conductors than the first partial layer.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: September 18, 2018
    Assignee: INTEL CORPORATION
    Inventors: Jackson Kong, Bok Eng Cheah, Khang Choong Yong, Howard L. Heck, Kuan-Yu Chen
  • VERTICAL TRENCH ROUTING IN A SUBSTRATE
    Publication number: 20160174374
    Abstract: An interconnect topology that includes vertical trench routing in a substrate is disclosed. In one embodiment, the interconnect comprises a substrate having a plurality of layers including a first ground plane layer; a pair of signal conductors that form a differential signal pair, each conductor of the pair of signal conductors having a first portion and a second portion, the second portion extending from the first portion into at least one of the plurality of layers, wherein width of the second portion is less than width of the first portion; and wherein the first ground plane layer is only a first partial layer and has a first void region that is closer to the pair of signal conductors than the first partial layer.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 16, 2016
    Inventors: Jackson Kong, Bok Eng Cheah, Khang Choong Yong, Howard L. Heck, Kuan-Yu Chen