Patents by Inventor Jackson Leong

Jackson Leong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220243197
    Abstract: Provided herein are compositions comprising recombinant polyclonal proteins (RPPs) derived from mammalian plasma cells and plasmablasts. Also provided are methods of using the RPPs.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 4, 2022
    Inventors: David Scott Johnson, Adam Shultz Adler, Rena Aviva Mizrahi, Yoong Wearn Lim, Michael Asensio, Sheila Keating, Renee Leong, Jackson Leong
  • Patent number: 5713752
    Abstract: Matable electrical connectors are protected against damage from excessive external force while they are reliably mated under normal conditions. One of the connectors 10 has a pair of latch devices 40a ,40b which are received in a pair of latch receiving recesses 23a ,23b in a connector housing 20. The latch devices 40 have resilient circular tongues 44 which are received in the recesses 23 with a controllable tensile force so that the latchable electrical connector 10 can be unmated from a matable connector 10' without manually unlatching the latch devices 40.
    Type: Grant
    Filed: July 22, 1996
    Date of Patent: February 3, 1998
    Assignee: The Whitaker Corporation
    Inventors: Jackson Leong, T. C. Teo, S. C. Tan, Tan Khiang Meng, Ricky Tan, Adrian Huan
  • Patent number: 5584708
    Abstract: A straddle connector avoids scraping off the solder from the conductive pads by the connection sections of electrical contacts during the connection of the connector to a circuit board. The straddle connector 10 comprises a housing 20 having an opening 21, and a separator 30 which is pushed by an edge 52 of the circuit board 50 when the latter is inserted in the opening 21. Connection sections 41 of the contacts 40 arranged in two rows along the inner walls of the opening 21 of the housing 20 are in contact with cam surfaces 31, 32 of the separator 30 which establishes a gap between opposing connection sections 41 during the insertion of the circuit board 50. After the insertion is completed, the gap between the connection sections 41 becomes smaller than the thickness of the circuit board 50, and the connection sections are applied to the solder-coated conductive pads 51 located on the surfaces of the circuit board at an appropriate pressure without scrapping solder from the conductive pads 51.
    Type: Grant
    Filed: December 13, 1994
    Date of Patent: December 17, 1996
    Assignee: The Whitaker Corporation
    Inventor: Jackson Leong