Patents by Inventor Jackson Lin

Jackson Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MOBILE GAS STORAGE SYSTEM
    Publication number: 20250146623
    Abstract: A mobile gas storage system can include a trailer skid, one or more gas tanks, and a compressor. At least one of the one or more gas tanks or the compressor are coupled to the trailer skid. The compressor is configured to compress gas from a gas source into the one or more gas tanks. The one or more gas tanks are configured to provide gas to a downstream device.
    Type: Application
    Filed: November 4, 2024
    Publication date: May 8, 2025
    Applicant: VOLTAGRID LLC
    Inventors: Jackson Lin, Leslie Michael Wise, Nathan Ough, Tejinder Singh Gill
  • Gap-filling process
    Patent number: 6833318
    Abstract: A gap-filling process is provided. A substrate having a dielectric layer thereon is provided. The dielectric layer has an opening therein. A gap-filling material layer is formed over the dielectric layer and inside the opening. A portion of the gap-filling material is removed from the gap-filling material layer to expose the dielectric layer. A gap-filling material treatment of the surface of the gap-filling material layer and the dielectric layer is carried out to planarize the gap-filling material layer so that a subsequently formed bottom anti-reflection coating or material layer over the gap-filling material layer can have a high degree of planarity.
    Type: Grant
    Filed: November 20, 2002
    Date of Patent: December 21, 2004
    Assignee: United Microelectronics Corp.
    Inventors: Chun-Jen Weng, Juan-Yi Chen, Hong-Tsz Pan, Cedric Lee, Der-Yuan Wu, Jackson Lin, Yeong-Song Yen, Lawrence Lin, Ying-Chung Tseng
  • Gap-filling process
    Publication number: 20040097069
    Abstract: A gap-filling process is provided. A substrate having a dielectric layer thereon is provided. The dielectric layer has an opening therein. A gap-filling material layer is formed over the dielectric layer and inside the opening. A portion of the gap-filling material is removed from the gap-filling material layer to expose the dielectric layer. A gap-filling material treatment of the surface of the gap-filling material layer and the dielectric layer is carried out to planarize the gap-filling material layer so that a subsequently formed bottom anti-reflection coating or material layer over the gap-filling material layer can have a high degree of planarity.
    Type: Application
    Filed: November 20, 2002
    Publication date: May 20, 2004
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Jen Weng, Juan-Yi Chen, Hong-Tsz Pan, Cedric Lee, Der-Yuan Wu, Jackson Lin, Yeong-Song Yen, Lawrence Lin, Ying-Chung Tseng