Patents by Inventor Jackson Lui

Jackson Lui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and methods of integrated-circuit device testing
    Patent number: 7872469
    Abstract: A motherboard device (MB) interface board (DIB) configured as universal interface to a family of integrated circuit (IC) devices provides the electrical connectivity to automated test equipment (ATE) and physical mating commonality with an IC device handler for reduced time to market and enhanced economy for design validation and production verification testing. In particular, use of one or more daughter cards (DC) that mount to the MB DIB avoid redesign of the entire DIB assembly for a new IC design. Each DC can be more quickly designed at a lower cost than the entire DIB assembly, enabling replacement of any defective site. The DC increases the available surface area for mounting of support components for the device under test (DUT).
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: January 18, 2011
    Assignee: QUALCOMM Incorporated
    Inventor: Jackson Lui
  • APPARATUS AND METHODS OF INTEGRATED-CIRCUIT DEVICE TESTING
    Publication number: 20090079419
    Abstract: A motherboard device (MB) interface board (DIB) configured as universal interface to a family of integrated circuit (IC) devices provides the electrical connectivity to automated test equipment (ATE) and physical mating commonality with an IC device handler for reduced time to market and enhanced economy for design validation and production verification testing. In particular, use of one or more daughter cards (DC) that mount to the MB DIB avoid redesign of the entire DIB assembly for a new IC design. Each DC can be more quickly designed at a lower cost than the entire DIB assembly, enabling replacement of any defective site. The DC increases the available surface area for mounting of support components for the device under test (DUT).
    Type: Application
    Filed: March 21, 2008
    Publication date: March 26, 2009
    Applicant: QUALCOMM INCORPORATED
    Inventor: Jackson Lui