Abstract: A wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave, a throttle gate coupled to the flow duct and configured to move from an open position to enable complete flow of solder through the solder distribution baffle and a closed position to inhibit a portion of flow of solder through the solder distribution baffle, and an exit wing coupled to the flow duct and configured to move from a lowered position to enable increased solder flow and a raised position to decrease solder flow. A controller is configured to control the movement of the throttle gate and the exit wing to control the flow of solder.

Abstract: A wave soldering machine includes a wave soldering station configured to create a solder wave used to perform the wave soldering operation on the printed circuit board. The wave soldering machine further includes a finger conveyor system configured to deliver a printed circuit board to the wave soldering station. The finger conveyor system includes at least one chain conveyor including a chain having a plurality of fingers configured to support an edge of the printed circuit board. The finger conveyor system further includes a finger detection system having a tension roller assembly configured to engage each finger of the plurality of fingers. The tension roller assembly further is configured to move in response to engaging a finger in a non-operational position. The finger conveyor system further includes a sensor configured to detect movement of the tension roller assembly to the non-operational position.

Abstract: A wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave, a throttle gate coupled to the flow duct and configured to move from an open position to enable complete flow of solder through the solder distribution baffle and a closed position to inhibit a portion of flow of solder through the solder distribution baffle, and an exit wing coupled to the flow duct and configured to move from a lowered position to enable increased solder flow and a raised position to decrease solder flow. A controller is configured to control the movement of the throttle gate and the exit wing to control the flow of solder.