Patents by Inventor Jackson Xu

Jackson Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component carrier having a laser via and method of manufacturing
    Patent number: 11166385
    Abstract: A component carrier is disclosed. The component carrier includes: i) at least one electrically insulating layer structure and at least one electrically conductive layer structure, wherein the electrically conductive layer structure is formed in or below the electrically insulating layer structure, and ii) a laser via formed in the electrically insulating layer structure and extending down to the electrically conductive layer structure, wherein the laser via is at least partially filled with an electrically conductive material. Hereby, a connection diameter at a first end of the laser via at the electrically conductive layer structure is equal to or larger than an opening diameter at a second end of the laser via facing away from the electrically conductive layer structure.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: November 2, 2021
    Assignee: AT&S (China) Co. Ltd.
    Inventors: Yee-Bing Ling, Kenny Cao, Jackson Xu
  • Component Carrier Having a Laser Via and Method of Manufacturing
    Publication number: 20200137892
    Abstract: A component carrier is disclosed. The component carrier includes: i) at least one electrically insulating layer structure and at least one electrically conductive layer structure, wherein the electrically conductive layer structure is formed in or below the electrically insulating layer structure, and ii) a laser via formed in the electrically insulating layer structure and extending down to the electrically conductive layer structure, wherein the laser via is at least partially filled with an electrically conductive material. Hereby, a connection diameter at a first end of the laser via at the electrically conductive layer structure is equal to or larger than an opening diameter at a second end of the laser via facing away from the electrically conductive layer structure.
    Type: Application
    Filed: July 18, 2019
    Publication date: April 30, 2020
    Inventors: Yee-Bing Ling, Kenny Cao, Jackson Xu