Abstract: An integrated circuit (IC) has logic and timing circuits that are coupled to discrete circuitry to provide protection and indications whenever an AC adapter that is faulty or has improper voltage levels or polarity are plugged into a system. In particular, the IC device provides over-voltage, under-voltage, and reversed-polarity protections to an electronic system to keep the electronic system from being damaged by an alternating current (AC) adapter having an improper voltage range or voltage polarity. It also provides a protection that prevents an adapter from powering a host system that has a short-circuit fault.

Abstract: A rectangular metal slice is cut into antenna sheet material. The antenna sheet material is further folded up to form the antenna. The antenna sheet material includes a radiating plate, a feeding plate, and a ground plate. The length of the radiating plate is approximate quarter wavelength corresponding to the operating frequency. The main feature of the antenna, according to the invention, is that the feeding plate and the ground plate extend in the same direction, thereby reducing the scale of the antenna.

Abstract: A method for integrating the zero-etch and STI-etch processes into one process is described. An etch stop layer is deposited on a substrate. A mask is formed overlying the etch stop layer having a first opening for a planned alignment mark and having a second opening for a planned shallow trench isolation region. The etch stop layer is etched away within the first and second openings and the semiconductor substrate exposed within the first and second openings is etched into a first depth to form a first trench underlying the first opening and a second trench underlying the second opening. The first trench is covered and the second trench is etched into the semiconductor substrate to a second depth greater than the first depth. The second trench is filled to complete formation of a shallow trench isolation region wherein the first trench completes formation of an alignment mark in the fabrication of an integrated circuit device.

Abstract: The present invention proposes an apparatus and a method for detecting the accuracy of drilled holes on a PCB, which can detect the positions, sizes, counts, and wall roughness of drilled holes on a PCB. The apparatus comprises an optical scanning tool and a platform situated below the optical scanning tool. The optical scanning tool can be positioned and moved. Two projecting light sources of parallel light beam are installed thereon to project light to the PCB. A signal receiver is installed between the two projecting light sources. A magnification lens is installed below the signal receiver. The signal receiver receives the light signal of the two projecting light sources reflected from the PCB via the magnification lens. The platform is used to place the PCB. The platform can move with respect to the optical scanning tool to control the distance between the optical scanning tool and the platform.