Patents by Inventor Jacky Chung

Jacky Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of heating/cooling a substrate
    Patent number: 9781773
    Abstract: A method of heating/cooling one or more substrates includes placing the one or more substrates on a rotatable hot-cold plate, wherein each substrate of the one or more substrates is placed on a corresponding sub-plate of a plurality of sub-plates of the rotatable hot-cold plate. The method further includes rotating the one or more substrates, wherein rotating the one or more substrates comprises rotating each substrate of the one or more substrates independently. The method further includes heating or cooling the one or more substrates using a heating-cooling element, wherein rotating the one or more substrates comprises rotating the one or more substrates relative to the heating-cooling element.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: October 3, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jui-Chun Peng, Jacky Chung, Heng-Hsin Liu, Chun-Hung Lin
  • METHOD OF HEATING/COOLING A SUBSTRATE
    Publication number: 20160183329
    Abstract: A method of heating/cooling one or more substrates includes placing the one or more substrates on a rotatable hot-cold plate, wherein each substrate of the one or more substrates is placed on a corresponding sub-plate of a plurality of sub-plates of the rotatable hot-cold plate. The method further includes rotating the one or more substrates, wherein rotating the one or more substrates comprises rotating each substrate of the one or more substrates independently. The method further includes heating or cooling the one or more substrates using a heating-cooling element, wherein rotating the one or more substrates comprises rotating the one or more substrates relative to the heating-cooling element.
    Type: Application
    Filed: March 2, 2016
    Publication date: June 23, 2016
    Inventors: Jui-Chun PENG, Jacky CHUNG, Heng-Hsin LIU, Chun-Hung LIN
  • Rotatable heating-cooling plate and element in proximity thereto
    Patent number: 9282592
    Abstract: An apparatus for selectively heating/cooling one or more substrates and establishing an approximately uniform temperature in the one or more substrates during a heating or cooling event is described. In one embodiment, the apparatus comprises a rotatable hot/cold plate onto which the one or more substrates are placed and a heating/cooling element disposed in close proximity to the rotatable hot/cold plate for selectively elevating/lowering the temperature of the one or more substrates.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: March 8, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jui-Chun Peng, Jacky Chung, Heng-Hsin Liu, Chun-Hung Lin
  • ROTATABLE PLATE AND HEATING/COOLING ELEMENT IN PROXIMITY THERETO
    Publication number: 20100219175
    Abstract: An apparatus for selectively heating/cooling one or more substrates and establishing an approximately uniform temperature in the one or more substrates during a heating or cooling event is described. In one embodiment, the apparatus comprises a rotatable hot/cold plate onto which the one or more substrates are placed and a heating/cooling element disposed in close proximity to the rotatable hot/cold plate for selectively elevating/lowering the temperature of the one or more substrates.
    Type: Application
    Filed: January 12, 2010
    Publication date: September 2, 2010
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jui-Chun Peng, Jacky Chung, Heng-Hsin Liu, Chun-Hung Lin