Abstract: The invention relates to a method (S) for attaching an SMD to a printed circuit (10), comprising the following steps: —applying an insulating layer (20) (S1) onto the printed circuit (10), —forming a cavity (22) in the insulating layer (20) above the conductive layer (12) (S2) of the printed circuit, —filling the cavity (22) with a solder paste (3), —positioning the SMD over the cavity (22) (S4), and —applying a heat treatment (S5) to the printed circuit (10).

Abstract: The invention relates to a method (S) for attaching an SMD to a printed circuit (10), comprising the following steps: —applying an insulating layer (20) (S1) onto the printed circuit (10), —forming a cavity (22) in the insulating layer (20) above the conductive layer (12) (S2) of the printed circuit, —filling the cavity (22) with a solder paste (3), —positioning the SMD over the cavity (22) (S4), and —applying a heat treatment (S5) to the printed circuit (10).

Abstract: The invention relates to a method for the restitution of an audio-visual work. According to the invention, the work is divided into sequences which are connected by nodes, whereby at least one of said nodes, known as the selection node, associates an order n sequence with at least two possible subsequent sequences of order n+1. The inventive method comprises a step involving the pseudo-random selection, for each restitution of the work and at each of the selection nodes, of one of the aforementioned possible subsequent sequences from a sub-set of authorised sequences, a subsequent sequence being authorised or denied as a function of at least one earlier selection of a sequence of order 0 to n. In this way, the work is played according to a variable, unpredictable chain of sequences, without the intervention of a spectator.

Abstract: A method is provided for producing a component or a module comprising a component assembly arranged on a substrate in a housing which is mountable on a printed circuit. The inventive method includes at least one stage when at least one part of the module is coated with an insulating material, and at least one stage when at least one conductive area is produced on one part of said insulating material in such a way that the areas forming and/or receiving at least one part of the component and/or at least one interconnection element are defined.

Abstract: The invention concerns a method for shielding at least the upper part of a radiocommunication module (1), said module being designed to be transferred on a mother board (5) and including components mounted on a printed circuit and providing at least one of the following functions. RF processing, digital processing and analog processing. The inventive method is characterised in that it comprises the following steps: coating at least the upper part (2) of said radiocommunication module with a resin and adding an electrically conductive layer at the surface of the resin. The invention also concerns a radiocommunication module whereof at least the upper part is thus shielded.

Abstract: Module for radiocommunication equipment intended to be transferred onto a motherboard and comprising components mounted on a printed circuit and ensuring at least one of the following functions: RF processing, numerical processing, and analog processing.