Patents by Inventor Jacob A. Abraham

Jacob A. Abraham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130175262
    Abstract: Techniques are disclosed relating to microwave ovens. In one embodiment, an apparatus is disclosed that includes a microwave heating unit. The microwave heating unit is configured to radiate microwaves into a cavity and includes an antenna array coupled to one or more amplifiers. The antenna array is configured to generate the radiated microwaves. In some embodiments, the microwave oven is configured to measure temperatures of a item within the cavity, and to steer a microwave beam produced by the antenna array based on the measured temperatures.
    Type: Application
    Filed: January 4, 2013
    Publication date: July 11, 2013
    Inventors: Ranjit Gharpurey, Jacob A. Abraham
  • Publication number: 20090328211
    Abstract: Provided are methods and systems for control flow deviation detection. Provided are methods for software security, comprising executing a software program, generating a run-time signature variable, updating the run-time signature variable as the software program executes, comparing the run-time signature variable with a pre-computed signature, and detecting a deviation in control flow of the software program based on the comparison between the run-time signature variable and the pre-computed signature.
    Type: Application
    Filed: June 15, 2009
    Publication date: December 31, 2009
    Inventors: Jacob A. Abraham, Ramtilak Vemu
  • Patent number: 6964004
    Abstract: A method for testing a system on a chip or a system on a package (““SOPC”) having a plurality of internal modules that are tested to determine whether predetermined performance specifications are satisfied. A first module of the SOPC is selected for testing. A determination is made as to whether the first module is directly accessible or not. If the first module is directly accessible, the module may be tested with automated test equipment external to the SOPC. If the first module is not directly accessible, the module may be tested with a second and third module of the SOPC.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: November 8, 2005
    Assignee: Ardext Technologies, Inc.
    Inventors: Abhijit Chatterjee, Dave Majernik, Sasikumar Cherubal, Sudip Chakrabarti, Ramakrishna Voorakaranam, Jacob A. Abraham, Douglas Goodman
  • Publication number: 20030158688
    Abstract: A method for testing a system on a chip or a system on a package (““SOPC”) having a plurality of internal modules that are tested to determine whether predetermined performance specifications are satisfied. A first module of the SOPC is selected for testing. A determination is made as to whether the first module is directly accessible or not. If the first module is directly accessible, the module may be tested with automated test equipment external to the SOPC. If the first module is not directly accessible, the module may be tested with a second and third module of the SOPC.
    Type: Application
    Filed: October 24, 2002
    Publication date: August 21, 2003
    Inventors: Abhijit Chatterjee, Dave Majernik, Sasikumar Cherubal, Sudip Chakrabarti, Ramakrishna Voorakaranam, Jacob A. Abraham, Douglas Goodman
  • Patent number: 4948757
    Abstract: A method for preferentially etching phosphosilicate glass to form a micromechanical structure includes forming a layer of phosphosilicate glass on a substrate and opening at least one via in the phosphosilicate glass layer. A layer of material which is patterned to produce a micromechanical structure is formed over the phosphosilicate glass layer which extends through the via and adheres to the substrate. The phosphosilicate glass layer is then removed by immersing the device in an etchant bath containing an aqueous ammoniacal hydrogen peroxide solution. The resulting micromechanical structure has at least one point of attachment to the substrate and is otherwise spaced apart from the substrate by an air gap. A method for attaching an overhanging mass to a miniature cantilever beam using microelectronics fabrication technology is also provided in which the center of gravity is shifted to the endpoint of the free end of the beam.
    Type: Grant
    Filed: February 9, 1989
    Date of Patent: August 14, 1990
    Assignee: General Motors Corporation
    Inventors: Kailash C. Jain, Jacob A. Abraham
  • Patent number: 4918032
    Abstract: A method for preferentially etching phosphosilicate glass to form a micromechanical structure includes forming a layer of phosphosilicate glass on a substrate and opening at least one via in the phosphosilicate glass layer. A layer of material which is patterned to produce a micromechanical structure is formed over the phosphosilicate glass layer which extends through the via and adheres to the substrate. The phosphosilicate glass layer is then removed by immersing the device in an etchant bath containing an aqueous ammoniacal hydrogen peroxide solution. The resulting micromechanical structure has at least one point of attachment to the substrate and is otherwise spaced apart from the substrate by an air gap. A method for attaching an overhanging mass to a miniature cantilever beam using microelectronics fabrication technology is also provided in which the center of gravity is shifted to the endpoint of the free end of the beam.
    Type: Grant
    Filed: July 8, 1988
    Date of Patent: April 17, 1990
    Assignee: General Motors Corporation
    Inventors: Kailash C. Jain, Jacob A. Abraham