Patents by Inventor Jacob A. Balma

Jacob A. Balma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230221083
    Abstract: A radiative heatsink includes a cold plate, a radiator mounted to the cold plate and a thermal compound located between and coupling the heat source to the cold plate. The thermal compound converts a portion of a first phononic thermal energy from the heat source into a first photonic near-field and a first photonic far-field thermal radiation and transfers the first photonic near-field, the first photonic far-field and the remaining of the first phononic thermal energy to the cold plate. The cold plate combines the first photonic near-field, the first photonic far-field and the remaining first phononic thermal energy into a second phononic thermal energy and provides the second phononic thermal energy to the radiator. The radiator converts the second phononic thermal energy into a second photonic near-field and a second photonic far-field and emits the second photonic near-field or the second photonic far-field such that cold plate is regenerated.
    Type: Application
    Filed: January 12, 2023
    Publication date: July 13, 2023
    Inventor: Jacob A. Balma
  • Publication number: 20220365548
    Abstract: A cooling system includes a plurality of sensor sub-units arranged in a grid having first sides configured to be thermally connected to a heat source and opposing second sides. The heat source including a plurality of sub-regions that correspond with the first sides of each of the plurality of sensor sub-units. The plurality of sensor sub-units are configured to sample temperatures of the sub-regions of the heat source. The cooling system also includes a plurality of solid-state cooling sub-units configured to dissipate heat, a plurality of heat exchanger channels and a controller configured to determine the one or more sub-regions of the heat source to cool. Each heat exchanger channel is configured to dissipate heat. At least one surface of at least one of the heat exchanger channels includes a coating configured to boost conversion of heat energy being dissipated into infrared radiation.
    Type: Application
    Filed: July 22, 2022
    Publication date: November 17, 2022
    Inventor: Jacob A. Balma
  • Patent number: 11435766
    Abstract: A cooling system includes a controller, a plurality of sensor sub-units, a plurality of solid-state cooling sub-units and a heat exchanger. The sensor sub-units are configured to be thermally connected to a heat source. The heat source has a plurality of sub-regions that correspond with each of the sensor sub-units. Each solid-state cooling sub-unit corresponds with and thermally connects to one of the sensor sub-units and is configured to dissipate heat from the sub-regions of the heat source. The heat exchanger is configured to dissipate heat from the sub-regions of the heat source and waste heat. The controller, based on temperatures sampled from the plurality of sensor sub-units and predictions made by an optimizer, is configured to determine the one or more sub-regions of the heat source to cool.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: September 6, 2022
    Assignee: Maxwell Labs Inc
    Inventor: Jacob A. Balma
  • Publication number: 20220129307
    Abstract: A technique includes receiving a request to process a job on a cluster. The job includes a plurality of ranks, the cluster includes a plurality of nodes, and the plurality of ranks can be equally divided among a minimal subset of nodes of the plurality of nodes such that all processing cores and the minimal set of nodes correspond to the plurality of ranks. The technique includes, in response to the request, scheduling processing of the job. The scheduling of the processing of the job includes distributing processing of the plurality of ranks across a set of nodes of the plurality of nodes greater in number than the minimal subset of nodes.
    Type: Application
    Filed: October 28, 2020
    Publication date: April 28, 2022
    Inventors: David G. Strenski, Ting-Ting Zhu, David L. Whitaker, Jacob A. Balma, Jeffrey M. Dawson
  • Publication number: 20200081464
    Abstract: A cooling system includes a controller, a plurality of sensor sub-units, a plurality of solid-state cooling sub-units and a heat exchanger. The sensor sub-units are configured to be thermally connected to a heat source. The heat source has a plurality of sub-regions that correspond with each of the sensor sub-units. Each solid-state cooling sub-unit corresponds with and thermally connects to one of the sensor sub-units and is configured to dissipate heat from the sub-regions of the heat source. The heat exchanger is configured to dissipate heat from the sub-regions of the heat source and waste heat. The controller, based on temperatures sampled from the plurality of sensor sub-units and predictions made by an optimizer, is configured to determine the one or more sub-regions of the heat source to cool.
    Type: Application
    Filed: September 9, 2019
    Publication date: March 12, 2020
    Inventor: Jacob A. Balma