Patents by Inventor Jacob A. BOND

Jacob A. BOND has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transforming sensor data to train models used with different sensor configurations
    Patent number: 11521348
    Abstract: A system includes a processor and a memory storing instructions which when executed by the processor configure the processor to receive first data from a first set of sensors arranged in a first configuration. The instructions configure the processor to transform the first data to a second data to train a model to recognize third data captured by a second set of sensors arranged in a second configuration. The second configuration is different than the first configuration. The instructions configure the processor to train the model based on the second set of sensors sensing the second data to recognize the third data captured by the second set of sensors arranged in the second configuration.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: December 6, 2022
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventor: Jacob A. Bond
  • TRANSFORMING SENSOR DATA TO TRAIN MODELS USED WITH DIFFERENT SENSOR CONFIGURATIONS
    Publication number: 20220284662
    Abstract: A system includes a processor and a memory storing instructions which when executed by the processor configure the processor to receive first data from a first set of sensors arranged in a first configuration. The instructions configure the processor to transform the first data to a second data to train a model to recognize third data captured by a second set of sensors arranged in a second configuration. The second configuration is different than the first configuration. The instructions configure the processor to train the model based on the second set of sensors sensing the second data to recognize the third data captured by the second set of sensors arranged in the second configuration.
    Type: Application
    Filed: March 8, 2021
    Publication date: September 8, 2022
    Inventor: Jacob A. BOND