Patents by Inventor Jacob A. Davis

Jacob A. Davis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for forming metallic ground grid for integrated circuits
    Patent number: 4261096
    Abstract: A metallic ground grid is fabricated by forming a conductor on the isolation barrier of an integrated circuit through openings in a first insulated layer to a depth less than the first insulated layer, forming a second insulated layer on said first conductor to the height of the first insulated layer, and interconnecting selected areas of the integrated circuit and the first conductor through openings in the insulated layers by a second conductor.
    Type: Grant
    Filed: March 30, 1979
    Date of Patent: April 14, 1981
    Assignee: Harris Corporation
    Inventors: Thomas J. Sanders, William R. Morcom, Jacob A. Davis
  • Process for forming metallic ground grid for integrated circuits
    Patent number: 4174562
    Abstract: A metallic ground grid is fabricated by forming a conductor on the isolation barrier of an integrated circuit through openings in a first insulated layer to a depth less than the first insulated layer, forming a second insulated layer on said first conductor to the height of the first insulated layer, and interconnecting selected areas of the integrated circuit and the first conductor through openings in the insulated layers by a second conductor.
    Type: Grant
    Filed: May 16, 1978
    Date of Patent: November 20, 1979
    Assignee: Harris Corporation
    Inventors: Thomas J. Sanders, William R. Morcom, Jacob A. Davis
  • Metallic ground grid for integrated circuits
    Patent number: 3974517
    Abstract: A metallic ground conductor grid applied over a planar isolation barrier in an integrated circuit provides a low resistance ground. An insulating layer, formed over the ground conductor, has apertures therein for interconnecting selected areas of the integrated circuit to the ground conductor grid.
    Type: Grant
    Filed: March 25, 1975
    Date of Patent: August 10, 1976
    Assignee: Harris Corporation
    Inventors: Thomas J. Sanders, Jacob A. Davis, William R. Morcom