Patents by Inventor Jacob Alan Hubbell

Jacob Alan Hubbell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11264871
    Abstract: An inverter drive assembly includes a first array of inverters, a second array of inverters spaced from the first array of inverters and defining a plenum therebetween, and a crossover bus bar spanning the plenum and electrically connecting the first array of inverters to the second array of inverters. The crossover bus bar includes a first laminated bus section electrically connected to the first array of inverters, a second laminated bus section electrically connected to the second array of inverters, and a solid bus connection interconnecting the first laminated bus section with the second laminated bus section.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: March 1, 2022
    Assignee: Transportation IP Holdings, LLC
    Inventors: Sarit Ratadiya, Jacob Alan Hubbell, Ajith Kuttannair Kumar, Mark Murphy, Shreenath Shekar Perlaguri
  • Patent number: 10819087
    Abstract: A bus assembly is provided having a bus bar with first and second conductive layers extending along an insulator sheet interposed between the first and second conductive layers. The first and second conductive layers are partially aligned with respect to each other to form a first overlap region of the insulator sheet. The bus assembly includes a first set of arms having a set of diodes and a second set of arms having a set of switches. The bust bar includes a plurality of bus links coupling the plurality of arms to the bus bar forming a plurality of inverters. Each of bus links include a respective first bracket and a respective second bracket aligned with each other forming a second overlap region of the insulator sheet. The first bracket is electrically coupled to the first conductive layer and the second bracket is electrically coupled to the second conductive layer.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: October 27, 2020
    Assignee: GE GLOBAL SOURCING LLC
    Inventors: Sarit Ratadiya, Ajith Kuttannair Kumar, Tharunendra Sekhar, Mark Allen Murphy, Jacob Alan Hubbell, Kevin Ruybal, Emil Nikolov, Maxim Tsupko, Jeffrey Louis Daigle
  • Publication number: 20200044519
    Abstract: An inverter drive assembly includes a first array of inverters, a second array of inverters spaced from the first array of inverters and defining a plenum therebetween, and a crossover bus bar spanning the plenum and electrically connecting the first array of inverters to the second array of inverters. The crossover bus bar includes a first laminated bus section electrically connected to the first array of inverters, a second laminated bus section electrically connected to the second array of inverters, and a solid bus connection interconnecting the first laminated bus section with the second laminated bus section.
    Type: Application
    Filed: October 11, 2019
    Publication date: February 6, 2020
    Inventors: Sarit Ratadiya, Jacob Alan Hubbell, Ajith Kuttannair Kumar, Mark Murphy, Shreenath Shekar Perlaguri
  • Publication number: 20190356116
    Abstract: A bus assembly is provided having a bus bar with first and second conductive layers extending along an insulator sheet interposed between the first and second conductive layers. The first and second conductive layers are partially aligned with respect to each other to form a first overlap region of the insulator sheet. The bus assembly includes a first set of arms having a set of diodes and a second set of arms having a set of switches. The bust bar includes a plurality of bus links coupling the plurality of arms to the bus bar forming a plurality of inverters. Each of bus links include a respective first bracket and a respective second bracket aligned with each other forming a second overlap region of the insulator sheet. The first bracket is electrically coupled to the first conductive layer and the second bracket is electrically coupled to the second conductive layer.
    Type: Application
    Filed: July 31, 2019
    Publication date: November 21, 2019
    Inventors: Sarit Ratadiya, Ajith Kuttannair Kumar, Tharunendra Sekhar, Mark Allen Murphy, Jacob Alan Hubbell, Kevin Ruybal, Emil Nikolov, Maxim Tsupko, Jeffrey Louis Daigle
  • Patent number: 10454349
    Abstract: An inverter drive assembly includes a first array of inverters, a second array of inverters spaced from the first array of inverters and defining a plenum therebetween, and a crossover bus bar spanning the plenum and electrically connecting the first array of inverters to the second array of inverters. The crossover bus bar includes a first laminated bus section electrically connected to the first array of inverters, a second laminated bus section electrically connected to the second array of inverters, and a solid bus connection interconnecting the first laminated bus section with the second laminated bus section.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: October 22, 2019
    Assignee: GE GLOBAL SOURCING LLC
    Inventors: Sarit Ratadiya, Jacob Alan Hubbell, Ajith Kuttannair Kumar, Mark Murphy, Shreenath Shekar Perlaguri
  • Patent number: 10384548
    Abstract: A bus assembly is provided having a bus bar with first and second conductive layers extending along an insulator sheet interposed between the first and second conductive layers. The first and second conductive layers are partially aligned with respect to each other to form a first overlap region of the insulator sheet. The bus assembly includes a first set of arms having a set of diodes and a second set of arms having a set of switches. The bust bar includes a plurality of bus links coupling the plurality of arms to the bus bar forming a plurality of inverters. Each of bus links include a respective first bracket and a respective second bracket aligned with each other forming a second overlap region of the insulator sheet. The first bracket is electrically coupled to the first conductive layer and the second bracket is electrically coupled to the second conductive layer.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: August 20, 2019
    Assignee: GE GLOBAL SOURCING LLC
    Inventors: Sarit Ratadiya, Ajith Kuttannair Kumar, Tharunendra Sekhar, Mark Allen Murphy, Jacob Alan Hubbell, Kevin Ruybal, Emil Nikolaev Nikolov
  • Publication number: 20170313196
    Abstract: A bus assembly is provided having a bus bar with first and second conductive layers extending along an insulator sheet interposed between the first and second conductive layers. The first and second conductive layers are partially aligned with respect to each other to form a first overlap region of the insulator sheet. The bus assembly includes a first set of arms having a set of diodes and a second set of arms having a set of switches. The bust bar includes a plurality of bus links coupling the plurality of arms to the bus bar forming a plurality of inverters. Each of bus links include a respective first bracket and a respective second bracket aligned with each other forming a second overlap region of the insulator sheet. The first bracket is electrically coupled to the first conductive layer and the second bracket is electrically coupled to the second conductive layer.
    Type: Application
    Filed: April 28, 2016
    Publication date: November 2, 2017
    Inventors: Sarit Ratadiya, Ajith Kuttannair Kumar, Tharunendra Sekhar, Mark Allen Murphy, Jacob Alan Hubbell, Kevin Ruybal, Emil Nikolaev Nikolov
  • Publication number: 20160308455
    Abstract: An inverter drive assembly includes a first array of inverters, a second array of inverters spaced from the first array of inverters and defining a plenum therebetween, and a crossover bus bar spanning the plenum and electrically connecting the first array of inverters to the second array of inverters. The crossover bus bar includes a first laminated bus section electrically connected to the first array of inverters, a second laminated bus section electrically connected to the second array of inverters, and a solid bus connection interconnecting the first laminated bus section with the second laminated bus section.
    Type: Application
    Filed: April 15, 2015
    Publication date: October 20, 2016
    Inventors: Sarit RATADIYA, Jacob Alan HUBBELL, Ajith Kuttannair KUMAR, Mark MURPHY, Shreenath Shekar PERLAGURI
  • Patent number: D760658
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: July 5, 2016
    Assignee: General Electric Company
    Inventors: Shreenath Shekar Perlaguri, Sarit Ratadiya, Mark Allen Murphy, Jain Raj Vettuvazhy Puthenpurayil, Jacob Alan Hubbell
  • Patent number: D784265
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: April 18, 2017
    Assignee: General Electric Company
    Inventors: Shreenath Shekar Perlaguri, Sarit Ratadiya, Jacob Alan Hubbell, Mark Allen Murphy, Jain Raj Vettuvazhy Puthenpurayil
  • Patent number: D806039
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: December 26, 2017
    Assignee: General Electric Company
    Inventors: Shreenath Shekar Perlaguri, Sarit Ratadiya, Jacob Alan Hubbell, Mark Allen Murphy, Jain Raj Vettuvazhy Puthenpurayil
  • Patent number: D834530
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: November 27, 2018
    Assignee: General Electric Company
    Inventors: Shreenath Shekar Perlaguri, Sarit Ratadiya, Jacob Alan Hubbell, Mark Allen Murphy, Jain Raj Vettuvazhy Puthenpurayil
  • Patent number: D848955
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: May 21, 2019
    Assignee: GE Global Sourcing LLC
    Inventors: Shreenath Shekar Perlaguri, Sarit Ratadiya, Jacob Alan Hubbell, Mark Allen Murphy, Jain Raj Vettuvazhy Puthenpurayil