Patents by Inventor Jacob B. Hersh

Jacob B. Hersh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly with at least one antenna and a thermal insulation component
    Patent number: 12237574
    Abstract: Some embodiments of the present disclosure relate to an assembly. In some embodiments the assembly comprises at least one antenna and a thermal insulation component. In some embodiments, the at least one antenna is configured to transmit a field of radiofrequency (RF) communication at an operating frequency ranging from 6 GHz to 100 GHz. In some embodiments, the thermal insulation component is disposed within the field of RF communication. In some embodiments, the thermal insulation component has a thermal conductivity ranging from 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1 atm.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: February 25, 2025
    Assignee: W. L. Gore & Associates, Inc.
    Inventors: Jacob B. Hersh, John C. Allen, Mitchell H. Warren, Lindsey C. Keen
  • ASSEMBLY WITH AT LEAST ONE ANTENNA AND A THERMAL INSULATION COMPONENT
    Publication number: 20210351501
    Abstract: Some embodiments of the present disclosure relate to an assembly. In some embodiments the assembly comprises at least one antenna and a thermal insulation component. In some embodiments, the at least one antenna is configured to transmit a field of radiofrequency (RF) communication at an operating frequency ranging from 6 GHz to 100 GHz. In some embodiments, the thermal insulation component is disposed within the field of RF communication. In some embodiments, the thermal insulation component has a thermal conductivity ranging from 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1 atm.
    Type: Application
    Filed: April 23, 2021
    Publication date: November 11, 2021
    Applicant: W. L. Gore & Associates, Inc.
    Inventors: Jacob B. Hersh, John C. Allen, Mitchell H. Warren, Lindsey C. Keen
  • Assembly with at least one antenna and a thermal insulation component
    Patent number: 11050144
    Abstract: Some embodiments of the present disclosure relate to an assembly. In some embodiments the assembly comprises at least one antenna and a thermal insulation component. In some embodiments, the at least one antenna is configured to transmit a field of radiofrequency (RF) communication at an operating frequency ranging from 6 GHz to 100 GHz. In some embodiments, the thermal insulation component is disposed within the field of RF communication. In some embodiments, the thermal insulation component has a thermal conductivity ranging from 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1 atm.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: June 29, 2021
    Assignee: W. L. Gore & Associates, Inc.
    Inventors: Jacob B. Hersh, John C. Allen, Mitchell H. Warren, Lindsey C. Keen