Patents by Inventor Jacob Becker

Jacob Becker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Backside etch process for transparent silicon oxide technology
    Patent number: 11852800
    Abstract: Increasing transparency of one or more micro-displays. A method includes attaching a transparent cover to at least a portion of a semiconductor wafer. The at least a portion of the semiconductor wafer includes the one or more micro-displays. The one or more micro-displays include one or more active silicon areas. The method further includes, after the transparent cover has been attached to the at least a portion of the semiconductor wafer, removing silicon between one or more of the active silicon areas, causing the one or more micro-displays to have a transparency of at least 50%.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: December 26, 2023
    Assignee: L3HARRIS TECHNOLOGIES, INC.
    Inventors: Jacob Becker, Jon Burnsed
  • BACKSIDE ETCH PROCESS FOR TRANSPARENT SILICON OXIDE TECHNOLOGY
    Publication number: 20230085741
    Abstract: Increasing transparency of one or more micro-displays. A method includes attaching a transparent cover to at least a portion of a semiconductor wafer. The at least a portion of the semiconductor wafer includes the one or more micro-displays. The one or more micro-displays include one or more active silicon areas. The method further includes, after the transparent cover has been attached to the at least a portion of the semiconductor wafer, removing silicon between one or more of the active silicon areas, causing the one or more micro-displays to have a transparency of at least 50%.
    Type: Application
    Filed: November 15, 2022
    Publication date: March 23, 2023
    Inventors: Jacob Becker, Jon Burnsed
  • Backside etch process for transparent silicon oxide technology
    Patent number: 11550140
    Abstract: Increasing transparency of one or more micro-displays. A method includes attaching a transparent cover to at least a portion of a semiconductor wafer. The at least a portion of the semiconductor wafer includes the one or more micro-displays. The one or more micro-displays include one or more active silicon areas. The method further includes, after the transparent cover has been attached to the at least a portion of the semiconductor wafer, removing silicon between one or more of the active silicon areas.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: January 10, 2023
    Assignee: L3HARRIS TECHNOLOGIES, INC.
    Inventors: Jacob Becker, Jon Burnsed
  • BACKSIDE ETCH PROCESS FOR TRANSPARENT SILICON OXIDE TECHNOLOGY
    Publication number: 20210349301
    Abstract: Increasing transparency of one or more micro-displays. A method includes attaching a transparent cover to at least a portion of a semiconductor wafer. The at least a portion of the semiconductor wafer includes the one or more micro-displays. The one or more micro-displays include one or more active silicon areas. The method further includes, after the transparent cover has been attached to the at least a portion of the semiconductor wafer, removing silicon between one or more of the active silicon areas.
    Type: Application
    Filed: May 6, 2020
    Publication date: November 11, 2021
    Inventors: Jacob Becker, Jon Burnsed