Abstract: A system is provided that electrically isolates a diode laser when the health of the diode laser deteriorates past a preset value. In addition to the diode laser and its power supply, the system includes a monitoring system that monitors the voltage across the diode laser and/or the voltage across a series resistor and/or the operating temperature of the diode laser and/or one or more characteristics of the output beam of the diode laser and/or the temperature of the diode laser coolant and/or the flow rate of the diode laser coolant. The system also includes a power supply controller and associated control circuit that is activated upon receipt of a trigger signal from the monitoring system.

Abstract: A test system includes a circuit assembly having an IC and an external circuit. The IC comprises test circuitry used to observe data indicative of target resistances in the external circuit. The test system evaluates the data to determine target resistance values. A first embodiment measures two output voltages responsive to a time varying reference voltage. The two output voltages can be used to determine resistance values in the external circuit. A second embodiment enables logic contention on the IC, controllably fixes a pull-down element on the IC, and controllably sweeps a pull-up element on the IC until the voltage at a node between the pull-down and pull-up elements and coupled to an external circuit exceeds a reference voltage.

Abstract: In one embodiment, a method for testing continuity of electrical paths through a circuit assembly includes: 1) mating a test-facilitating circuit package to a connector of the circuit assembly; the circuit package having a plurality of contacts for mating to a plurality of contacts of the connector; the circuit package containing incomplete or no mission circuitry for the circuit assembly, but containing a plurality of passive circuit components coupled in parallel between the package's plurality of contacts and a test sensor port of the circuit package; 2) stimulating one or more nodes of the circuit assembly; 3) measuring an electrical characteristic of the circuit package; and 4) comparing the measured electrical characteristic to at least one threshold to assess continuities of at least two electrical paths through the circuit assembly. Other embodiments are also disclosed.

Abstract: A device for testing continuity of electrical paths through a connector of a circuit assembly has a package containing incomplete or no mission circuitry for the circuit assembly. The package is provided with a plurality of contacts for mating to a plurality of contacts of the connector. A test sensor port is integrated with the package. A plurality of passive circuit components are integrated with the package, ones of which are coupled in parallel between ones of the contacts on the package and the test sensor port.