Patents by Inventor Jacob C. Killens

Jacob C. Killens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10290939
    Abstract: Systems and methods are provided for regulating heat for a Phased Array Antenna (PAA). The system includes a PAA, which includes array elements to handle Radio Frequency (RF) signals. The PAA also includes a circuit. The circuit includes an amplifier that operates on a current to amplify signals for the PAA, and a sensor that measures temperature at the MMIC. The PAA also includes an array controller that adjusts the current for the amplifier based on a temperature measured by the sensor.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: May 14, 2019
    Assignee: THE BOEING COMPANY
    Inventors: Rodney K. Bonebright, Mark William Steeds, Gary Wilsey, Jacob C. Killens
  • Publication number: 20180076518
    Abstract: Systems and methods are provided for regulating heat for a Phased Array Antenna (PAA). The system includes a PAA, which includes array elements to handle Radio Frequency (RF) signals. The PAA also includes a circuit. The circuit includes an amplifier that operates on a current to amplify signals for the PAA, and a sensor that measures temperature at the MMIC. The PAA also includes an array controller that adjusts the current for the amplifier based on a temperature measured by the sensor.
    Type: Application
    Filed: July 24, 2015
    Publication date: March 15, 2018
    Inventors: Rodney K. Bonebright, Mark William Steeds, Gary Wilsey, Jacob C. Killens
  • Patent number: 9543915
    Abstract: Systems and methods according to one or more embodiments are provided for stacked active RF circuits implemented as amplification stages in high gain phased array antenna systems. Stacked active RF circuits may be implemented, for example, as an amplification stage of an element electronic circuit. Stacked active RF circuits may be implemented, for example, as a second amplification stage to maintain amplification in a high gain phased array antenna system. In one example, a system comprises a substrate comprising a plurality of substrate layers and one or more input ports and output ports. A plurality of amplification stages comprising a plurality of amplifiers, attenuators, and phase shifters are integrated within the plurality of substrate layers, the amplification stage coupled between the input and output ports. One or more monitor circuits are coupled to the plurality of amplification stages. Additional systems and methods are also provided.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: January 10, 2017
    Assignee: The Boeing Company
    Inventors: Rodney K. Bonebright, Jacob C. Killens, Mark W. Steeds