Abstract: A housing for an outside plant telecommunication equipment (OSP) which uses modular heat sink assemblies. OSP housings contain electronic circuit boards on which are mounted electrical components that generate heat. Thermal conductors or mesas contact the electrical components to conduct heat from the components to the environment. Rather than create single purpose housings with cast thermal conductors, the improved housing uses heat sink plates which can easily be swapped out to accommodate a variety of electronic circuit boards that might be needed within a general purpose housing. Together with faster turnaround time to create a new design for a housing, lower manufacturing and inventory costs result.

Abstract: A blank, or dummy, face plate element engages top and bottom edges of a cabinet frame, directly behind a front panel card insertion opening that provides access to multiple card slots of an electronic equipment rack. The dummy face plate includes a rearwardly projecting, upper lip, that is located adjacent to a top edge of the face plate, and has a notch immediately adjacent to the rear surface of the face plate. The notch fits within and is captured by an upper edge of the cabinet frame. A rearwardly projecting, generally U-shaped, flexible lower lip is provided adjacent to a lower edge of the face plate and includes a pair of finger grips. The flexible lower lip has a ridge that becomes aligned with the lower edge of the faceplate when the lower lip is flexed upwardly toward the first lip, and a notch adjacent to the ridge that is captured by the cabinet frame.