Patents by Inventor Jacob Greenspan

Jacob Greenspan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4928368
    Abstract: A method of diffusion bonding copper to titanium alloy employing hot isosic pressure by an inert gas in a sealed chamber. Use of niobium metal as an interfoil between the copper and titanium alloy and the application of the method to the manufacture of a projectile is also disclosed.
    Type: Grant
    Filed: March 7, 1989
    Date of Patent: May 29, 1990
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Jacob Greenspan, Gasper J. Sacco
  • Patent number: 4911060
    Abstract: A gun tube having an outer sleeve of reduced weight from that of the base d having improved characteristics in firing accuracy. A method of fabrication pertaining to a selected titanium alloy sleeve in combination with a steel base is also disclosed.
    Type: Grant
    Filed: March 20, 1989
    Date of Patent: March 27, 1990
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Jacob Greenspan, Richard G. Hasenbein, Edward J. Hyland