Abstract: Some variations provide a process for additive manufacturing of a nanofunctionalized metal alloy, comprising: providing a nanofunctionalized metal precursor containing metals and grain-refining nanoparticles; exposing a first amount of the nanofunctionalized metal precursor to an energy source for melting the precursor, thereby generating a first melt layer; solidifying the first melt layer, thereby generating a first solid layer; and repeating many times to generate a plurality of solid layers in an additive-manufacturing build direction. The additively manufactured, nanofunctionalized metal alloy has a microstructure with equiaxed grains.

Abstract: Some variations provide a process for additive manufacturing of a nanofunctionalized metal alloy, comprising: providing a nanofunctionalized metal precursor containing metals and grain-refining nanoparticles; exposing a first amount of the nanofunctionalized metal precursor to an energy source for melting the precursor, thereby generating a first melt layer; solidifying the first melt layer, thereby generating a first solid layer; and repeating many times to generate a plurality of solid layers in an additive-manufacturing build direction. The additively manufactured, nanofunctionalized metal alloy has a microstructure with equiaxed grains.

Abstract: The workable range is extended into lower pressure region for micromechanical pressure sensors of the kind having a vibrating mass in proximity of a stationary surface by increasing the amount of squeeze damping. The amount of squeeze damping is increased by using the symmetry of a circular disk-shaped vibrating mass and restricting or changing the flow path of the gas in and out of a squeeze damping space. A circular vibrating mass is supported through an annular spring by a support ring attached to the substrate surface by a plurality of mesas which serve to block the gas flow into and out of the squeeze damping space between the mass and the substrate surface. The amount of squeeze damping may be increased by providing the support ring which completely encloses the squeeze damping space with the vibrating mass having a hole through which the gas may enter and leave the space.

Abstract: A cover for a micromechanical device through which input/output connections to the device are made. The cover includes at least two doped semiconductor standoffs supporting an insulative layer. One or more metalized vias extend from a top surface of the insulative layer, or from a bottom surface of the base, to a respective standoff. Electrical connection is made to the covered device through the metalized vias and doped semiconductor standoffs. The covered chip may be vacuum sealed by providing a ring-like standoff which borders the covered device when the cover is bonded to the base. The resulting covered chip is adaptable for various chip mounting techniques, including flip chip mounting, side mounting combined with either tape automated bonding (TAB) or conductive epoxy connections, or epoxy chip attachment with wire bonding connections. In one embodiment, conductive bumps are formed on the top surface of the insulative cover layer to accommodate flip chip mounting.

Abstract: An improved gas pressure gauge is disclosed that extends the linear range of pressure dependent damping to higher pressures by placing a stationary member in very close proximity to the vibrating member. This range of linear dependent damping is also extended to lower pressures by making the vibrating member large in area relative to its small distance from a fixed planar member, which can also serve as its supporting member, by making it vibrate in a direction perpendicular to the fixed planar member, and by making the springs that support the vibrating member from a high Q and conductive material, such as boron doped single crystal silicon. These features for extending the range to higher and lower pressures can be built separately into two independent vibrating elements that can be used individually or in tandem, or they can be built into a single vibrating element that can be made to vibrate in two modes, one parallel and one perpendicular to a fixed member.

Abstract: An improved ceramic substrate for supporting, cooling and interconnecting components on both surfaces of a substrate includes a plurality of coolant carrying channels separated by fins and extending through the substrate generally parallel to the surfaces of the substrate; and a plurality of routed vias for interconnecting component terminations on opposite surfaces of the substrate which are not aligned with each other and with a fin; each routed via includes an internal via extending through a fin and a surface blind via extending inwardly from each surface, and at least one transverse segment interconnecting one end of the internal via to one of the surface blind vias.

Abstract: A composite heat transfer device is disclosed, for mounting with an object having a predetermined coefficient of thermal expansion, including a composite heat conductive member having a quantity of first and second materials; the first material having a positive coefficient of thermal expansion and the second material having a negative coefficient of thermal expansion. The first and second materials are combined in a quantity ratio to produce a composite heat transfer device with a coefficient of thermal expansion which can be closely tailored to match the predetermined coefficient of thermal expansion of the object with which heat is to be transferred. Also included is a heat transfer assembly including a circuit board on which are located a plurality of heat generating devices. The circuit board is mounted proximate a composite heat conductive member. The composite heat conductive member is mounted proximate a hollow core structure which forms passageways through which may flow a fluid medium.

Abstract: A formed non-planar heat exchanger having two non-planar plates continuously joined across their contacting surfaces and complementarily curved to form an integral curved member; at least one channel is formed in at least one of the plates to define an integral internal heat exchange fluid flow passage within the curve contour of the curved member; the integral internal heat exchange fluid flow passage conforms with the curved member. A method of making such a device is also disclosed.

Abstract: An ultra-fast quenching device for rapidly quenching material includes a housing for defining a quenching area. A plurality of inlet ports are disposed in the housing and are generally evenly distributed within the housing for controlling the locations and amounts of quenching fluid discharged against a surface of material disposed in the quenching area. A plurality of exhaust ports are disposed interstitially among the inlet ports for removing quenching fluid local to the inlet ports to control the rate and profile of heat transfer, from the material to the quenching fluid, across the surface of the material.

Abstract: A method of making a formed non-planar heat exchanger is disclosed in which two non-planar plates are continuously joined across their contacting surfaces and are complementarily curved to form an integral curved member where at least one of the contacting surfaces is provided with at least one channel to define an integral internal heat exchange fluid flow passage within and conforming to the curved contour of the curved member.

Abstract: A conforming heat sink assembly including a heat dispersive element is mounted in spaced relationship to a surface from which heat is to be conducted. A thermal interface is provided for coupling the heat dispersive element to the surface from which heat is to be conducted. The thermal interface includes an elastomeric member which occupies only a portion of a volume defined by mounting the heat dispersive element proximate the surface from which heat is to be conducted. The unoccupied volume allows the elastomeric member to easily conform to the irregular surface from which heat is to be conducted to enhance thermal conductivity from the surface to the heat dispersive member.

Abstract: A monitoring system for detecting contamination of a liquid entrained in a circulating fluid, including a housing having an inlet for receiving the fluid, a reservoir for containing extracted liquid, and an outlet portion disposed in predetermined relationship with the reservoir for venting the fluid from the housing. There is also a separator, which may be formed as part of the housing, for extracting liquid from the fluid and directing the extracted liquid to the reservoir. A probe, disposed in the reservoir, measures an electrical parameter representative of the electrical resistance of the liquid to detect a change in resistivity indicative of contamination of the liquid.

Abstract: A monitoring system for detecting contamination of a liquid entrained in a circulating fluid, including a housing having an inlet for receiving the fluid, a reservoir for containing extracted liquid, and an outlet portion disposed in predetermined relationship with the reservoir for venting the fluid from the housing. There is also a separator, which may be formed as part of the housing, for extracting liquid from the fluid and directing the extracted liquid to the reservoir. A probe, disposed in the reservoir, measures an electrical parameter representative of the electrical resistance of the liquid to detect a change in resistivity indicative of contamination of the liquid.

Abstract: A machine for grinding an object, such as a printed circuit board coupon, having a region to be exposed and having a novel control track that has at least a portion of the rear edge of the track precisely located with respect to a predetermined grinding depth for the region is provided according to this invention. The grinding machine includes means for engaging the object with an abrasive device and means, interconnected with the control track on the object, for disengaging the object and the abrasive device when a break in the track has been ground.

Abstract: A circuit board with connectors along more than one side designed to be stacked with similar boards, having a plurality of electrical contacts to connect to a connector header with resilient contacts, applying a force to the circuit board which is inclined from a central axis whereby the circuit board and the connector header join a tight, reliable compression contact.