Patents by Inventor Jacob HAMILTON

Jacob HAMILTON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PCM metal shielding for wafer testing
    Patent number: 11670555
    Abstract: Method and devices to reduce integrated circuit fabrication process yield loss due to undesired interactions between PCMs and the wafer test probes during wafer sorting tests are disclosed. The described methods entail the use of a properly patterned metal layer on the PCM dies adjacent to the product dies under test. Such patterned metal layers shield traces of the wafer probes from the circuits of the PCM dies. Various exemplary metal layer patterns are also presented.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: June 6, 2023
    Assignee: PSEMI CORPORATION
    Inventors: Jacob Hamilton, Tran Kononova, Jay Kothari, Matt Allison, Kim T. Nguyen, Eric S. Shapiro
  • PCM METAL SHIELDING FOR WAFER TESTING
    Publication number: 20220199475
    Abstract: Method and devices to reduce integrated circuit fabrication process yield loss due to undesired interactions between PCMs and the wafer test probes during wafer sorting tests are disclosed. The described methods entail the use of a properly patterned metal layer on the PCM dies adjacent to the product dies under test. Such patterned metal layers shield traces of the wafer probes from the circuits of the PCM dies. Various exemplary metal layer patterns are also presented.
    Type: Application
    Filed: December 18, 2020
    Publication date: June 23, 2022
    Inventors: Jacob HAMILTON, Tran KONONOVA, Jay KOTHARI, Matt ALLISON, Kim T. NGUYEN, Eric S. SHAPIRO