Patents by Inventor Jacob HAMILTON

Jacob HAMILTON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240333722
    Abstract: Systems and methods for end user elevation and anonymous administrative login are disclosed. An agent executing on a client device can provide a graphical element within a user interface presented by the client device upon detection of a request for elevated user privileges. Upon an interaction with the graphical element, the agent transmits, to a server, data corresponding to the request for elevated user privileges, and receives, from the server, a message indicating approval of the request for elevated user privileges. The agent provides, to the operating system of the client device, an indication that the request for elevated user privileges is approved.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Applicant: ConnectWise, LLC
    Inventors: Jacob Hamilton MORGAN, Berry Mayfield REYNOLDS, IV
  • Publication number: 20240333723
    Abstract: Systems and methods for end user elevation and anonymous administrative login are disclosed. An agent executing on a client device can provide a graphical element within a user interface presented by the client device upon detection of a request for elevated user privileges. Upon an interaction with the graphical element, the agent transmits, to a server, data corresponding to the request for elevated user privileges, and receives, from the server, a message indicating approval of the request for elevated user privileges. The agent provides, to the operating system of the client device, an indication that the request for elevated user privileges is approved.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Applicant: ConnectWise, LLC
    Inventors: Jacob Hamilton MORGAN, Berry Mayfield REYNOLDS, IV
  • Patent number: 11670555
    Abstract: Method and devices to reduce integrated circuit fabrication process yield loss due to undesired interactions between PCMs and the wafer test probes during wafer sorting tests are disclosed. The described methods entail the use of a properly patterned metal layer on the PCM dies adjacent to the product dies under test. Such patterned metal layers shield traces of the wafer probes from the circuits of the PCM dies. Various exemplary metal layer patterns are also presented.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: June 6, 2023
    Assignee: PSEMI CORPORATION
    Inventors: Jacob Hamilton, Tran Kononova, Jay Kothari, Matt Allison, Kim T. Nguyen, Eric S. Shapiro
  • Publication number: 20220199475
    Abstract: Method and devices to reduce integrated circuit fabrication process yield loss due to undesired interactions between PCMs and the wafer test probes during wafer sorting tests are disclosed. The described methods entail the use of a properly patterned metal layer on the PCM dies adjacent to the product dies under test. Such patterned metal layers shield traces of the wafer probes from the circuits of the PCM dies. Various exemplary metal layer patterns are also presented.
    Type: Application
    Filed: December 18, 2020
    Publication date: June 23, 2022
    Inventors: Jacob HAMILTON, Tran KONONOVA, Jay KOTHARI, Matt ALLISON, Kim T. NGUYEN, Eric S. SHAPIRO