Patents by Inventor Jacob Harding
Jacob Harding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10855677Abstract: The application describes an authentication process that incorporates voice commands with an HTTP interface module to perform a multifactor authentication (MFA) process. For example, a first computer system may initiate the MFA process by sending, with a HTTP interface module maintained by the first computer system, a request to initiate the MFA process to the second computer system. The MFA process may also transmit an one-time password (OTP) to a first user device. The first computer system may receive an audible recitation of the OTP from a second user device. The OTP may be parsed and used to generate an HTTP request. The HTTP interface module may send the HTTP request to the second computer system. When the second computer system authenticates the user based at least in part on the non-audible file, the first computer system may receive confirmation of authentication of the user to initiate the transaction.Type: GrantFiled: November 30, 2018Date of Patent: December 1, 2020Assignee: Amazon Technologies, Inc.Inventors: Aravindhan Vijayaraghavan, Sudheer Reddy Battula, Kumar Brahnmath, Thomas Haider, Jacob Harding, Ram Kakkad, Rishikesan Rangarajan
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Publication number: 20200177581Abstract: The application describes an authentication process that incorporates voice commands with an HTTP interface module to perform a multifactor authentication (MFA) process. For example, a first computer system may initiate the MFA process by sending, with a HTTP interface module maintained by the first computer system, a request to initiate the MFA process to the second computer system. The MFA process may also transmit an one-time password (OTP) to a first user device. The first computer system may receive an audible recitation of the OTP from a second user device. The OTP may be parsed and used to generate an HTTP request. The HTTP interface module may send the HTTP request to the second computer system. When the second computer system authenticates the user based at least in part on the non-audible file, the first computer system may receive confirmation of authentication of the user to initiate the transaction.Type: ApplicationFiled: November 30, 2018Publication date: June 4, 2020Inventors: Aravindhan Vijayaraghavan, Sudheer Reddy Battula, Kumar Brahnmath, Thomas Haider, Jacob Harding, Ram Kakkad, Rishikesan Rangarajan
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Patent number: 9576719Abstract: Embodiments of an electromagnetic coil assembly are provided, as are methods for the manufacture of an electromagnetic coil assembly. In one embodiment, the method for manufacturing an electromagnetic coil assembly includes the steps of providing a braided aluminum lead wire having a first end portion and a second end portion, brazing the first end portion of the braided aluminum lead wire to a first electrically-conductive interconnect member, and winding a magnet wire into an electromagnetic coil. The second end portion of the braided aluminum lead wire is joined to the magnet wire after the step of brazing.Type: GrantFiled: June 17, 2015Date of Patent: February 21, 2017Assignee: HONEYWELL INTERNATIONAL INC.Inventors: James Piascik, Robert Franconi, Jacob Harding, Jimmy Wiggins, Eric Passman, Richard Fox
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Patent number: 9508486Abstract: Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the high temperature electromagnetic coil assembly includes a coiled anodized aluminum wire and an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded. The electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire.Type: GrantFiled: September 24, 2013Date of Patent: November 29, 2016Assignee: HONEYWELL INTERNATIONAL INC.Inventors: James Piascik, Eric Passman, Reza Oboodi, Robert Franconi, Richard Fox, Gary J. Seminara, Gene Holden, Jacob Harding
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Publication number: 20160072268Abstract: Methods and devices are provided for supporting a wire having a minimum tolerable bend radius. The device comprises a core portion with a longitudinal axis supporting at least a first portion of the wire and a flange portion attached to the core portion supporting at least a second portion of the wire. The device has at least one hole with a first opening in the first surface defined by a first rim and a second opening in the second surface defined by a second rim. The hole allows the wire to pass through and also supports the wire. The hole is oriented in three dimensions to forestall a bend that may occur in the wire having a bend radius that is less than the minimum tolerable bend radius of the wire.Type: ApplicationFiled: November 13, 2015Publication date: March 10, 2016Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Gene Holden, Jacob Harding
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Patent number: 9203228Abstract: Methods and devices are provided for supporting a wire having a minimum tolerable bend radius. The device comprises a core portion with a longitudinal axis supporting at least a first portion of the wire and a flange portion attached to the core portion supporting at least a second portion of the wire. The device has at least one hole with a first opening in the first surface defined by a first rim and a second opening in the second surface defined by a second rim. The hole allows the wire to pass through and also supports the wire. The hole is oriented in three dimensions to forestall a bend that may occur in the wire having a bend radius that is less than the minimum tolerable bend radius of the wire.Type: GrantFiled: April 30, 2010Date of Patent: December 1, 2015Assignee: HONEYWELL INTERNATIONAL INC.Inventors: Gene Holden, Jacob Harding
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Publication number: 20150287522Abstract: Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the high temperature electromagnetic coil assembly includes a coiled anodized aluminum wire and an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded. The electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire.Type: ApplicationFiled: September 24, 2013Publication date: October 8, 2015Inventors: James Piascik, Eric Passman, Reza Oboodi, Robert Franconi, Richard Fox, Gary J. Seminara, Gene Holden, Jacob Harding
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Publication number: 20150287518Abstract: Embodiments of an electromagnetic coil assembly are provided, as are methods for the manufacture of an electromagnetic coil assembly. In one embodiment, the method for manufacturing an electromagnetic coil assembly includes the steps of providing a braided aluminum lead wire having a first end portion and a second end portion, brazing the first end portion of the braided aluminum lead wire to a first electrically-conductive interconnect member, and winding a magnet wire into an electromagnetic coil. The second end portion of the braided aluminum lead wire is joined to the magnet wire after the step of brazing.Type: ApplicationFiled: June 17, 2015Publication date: October 8, 2015Applicant: HONEYWELL INTERNATIONAL INC.Inventors: James Piascik, Robert Franconi, Jacob Harding, Jimmy Wiggins, Eric Passman, Richard Fox
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Patent number: 9076581Abstract: By way of example, a method for manufacturing an electromagnetic coil assembly includes the steps of providing a braided aluminum lead wire having a first end portion and a second end portion, brazing the first end portion of the braided aluminum lead wire to a first electrically-conductive interconnect member, and winding a magnet wire into an electromagnetic coil. The second end portion of the braided aluminum lead wire is joined to the magnet wire after the step of brazing.Type: GrantFiled: April 30, 2012Date of Patent: July 7, 2015Assignee: HONEYWELL INTERNATIONAL INC.Inventors: James Piascik, Robert Franconi, Jacob Harding, Jimmy Wiggins, Eric Passman, Richard Fox
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Patent number: 8994486Abstract: Embodiments of a method are provided for joining a secondary wire to a magnet wire, such as a fine gauge aluminum or silver wire. Further provided are embodiments of a disparate wire splice connector and embodiments of an electromagnetic coil assembly including such a splice connector. In one embodiment, the electromagnetic coil assembly includes disparate wire splice connector having a first blind bore and a second blind bore. A coiled magnet wire having a segment inserted into the first blind bore is soldered to the disparate wire splice connector. A secondary wire having a segment inserted into the second blind bore is also soldered to the disparate wire splice connector such that the secondary wire is electrically coupled to the coiled magnet wire through the disparate wire splice connector.Type: GrantFiled: June 11, 2012Date of Patent: March 31, 2015Assignee: Honeywell International Inc.Inventors: Gene Holden, Jacob Harding
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Patent number: 8754735Abstract: Embodiments of an electromagnetic coil assembly are provided, as are methods for the manufacture of an electromagnetic coil assembly. In one embodiment, the electromagnetic coil assembly includes coiled magnet wire and a braided lead wire, which has a first end segment electrically coupled to the coiled magnet wire and having a second end segment. The electromagnetic coil assembly further includes an electrically-conductive member to which the second end segment of the braided lead wire is crimped.Type: GrantFiled: April 30, 2012Date of Patent: June 17, 2014Assignee: Honeywell International Inc.Inventors: James Piascik, Jacob Harding, Eric Passman, Robert Franconi, Richard Fox
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Patent number: 8572838Abstract: Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the method includes the steps of applying a high thermal expansion ceramic coating over an anodized aluminum wire, coiling the coated anodized aluminum wire around a support structure, and curing the high thermal expansion ceramic coating after coiling to produce an electrically insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded.Type: GrantFiled: March 2, 2011Date of Patent: November 5, 2013Assignee: Honeywell International Inc.Inventors: James Piascik, Eric Passman, Reza Oboodi, Robert Franconi, Richard Fox, Gary J. Seminara, Gene Holden, Jacob Harding
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Publication number: 20130285777Abstract: Embodiments of an electromagnetic coil assembly are provided, as are methods for the manufacture of an electromagnetic coil assembly. In one embodiment, the electromagnetic coil assembly includes coiled magnet wire and a braided lead wire, which has a first end segment electrically coupled to the coiled magnet wire and having a second end segment. The electromagnetic coil assembly further includes an electrically-conductive member to which the second end segment of the braided lead wire is crimped.Type: ApplicationFiled: April 30, 2012Publication date: October 31, 2013Applicant: HONEYWELL INTERNATIONAL INC.Inventors: James Piascik, Jacob Harding, Eric Passman, Robert Franconi, Richard Fox
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Publication number: 20130285776Abstract: Embodiments of an electromagnetic coil assembly are provided, as are methods for the manufacture of an electromagnetic coil assembly. In one embodiment, the method for manufacturing an electromagnetic coil assembly includes the steps of providing a braided aluminum lead wire having a first end portion and a second end portion, brazing the first end portion of the braided aluminum lead wire to a first electrically-conductive interconnect member, and winding a magnet wire into an electromagnetic coil. The second end portion of the braided aluminum lead wire is joined to the magnet wire after the step of brazing.Type: ApplicationFiled: April 30, 2012Publication date: October 31, 2013Applicant: HONEYWELL INTERNATIONAL INC.Inventors: James Piascik, Robert Franconi, Jacob Harding, Jimmy Wiggins, Eric Passman, Richard Fox
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Publication number: 20130082809Abstract: Embodiments of a method are provided for joining a secondary wire to a magnet wire, such as a fine gauge aluminum or silver wire. Further provided are embodiments of a disparate wire splice connector and embodiments of an electromagnetic coil assembly including such a splice connector. In one embodiment, the electromagnetic coil assembly includes disparate wire splice connector having a first blind bore and a second blind bore. A coiled magnet wire having a segment inserted into the first blind bore is soldered to the disparate wire splice connector. A secondary wire having a segment inserted into the second blind bore is also soldered to the disparate wire splice connector such that the secondary wire is electrically coupled to the coiled magnet wire through the disparate wire splice connector.Type: ApplicationFiled: June 11, 2012Publication date: April 4, 2013Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Gene Holden, Jacob Harding
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Publication number: 20120225784Abstract: Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the method includes the steps of applying a high thermal expansion ceramic coating over an anodized aluminum wire, coiling the coated anodized aluminum wire around a support structure, and curing the high thermal expansion ceramic coating after coiling to produce an electrically insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded.Type: ApplicationFiled: March 2, 2011Publication date: September 6, 2012Applicant: HONEYWELL INTERNATIONAL INC.Inventors: James Piascik, Eric Passman, Reza Oboodi, Robert Franconi, Richard Fox, Gary J Seminara, Gene Holden, Jacob Harding
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Patent number: 8205786Abstract: Embodiments of a method are provided for joining an aluminum wire to a secondary wire, as are embodiments of an aluminum wire splice connector and embodiments of an electromagnetic coil assembly including an aluminum wire splice connector. In one embodiment, the method includes the steps providing a splice connector having a first blind bore and a second blind bore, inserting a segment of a coiled aluminum magnet wire into the first blind bore, and inserting a segment of the secondary wire into the second blind bore. The splice connector is soldered to the segments of the aluminum wire and the secondary wire inserted into the first and second blind bores, respectively, to electrically couple the coiled aluminum magnet wire and the secondary wire through the splice connector.Type: GrantFiled: October 3, 2011Date of Patent: June 26, 2012Assignee: Honeywell International Inc.Inventors: Gene Holden, Jacob Harding
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Publication number: 20110266401Abstract: Methods and devices are provided for supporting a wire having a minimum tolerable bend radius. The device comprises a core portion with a longitudinal axis supporting at least a first portion of the wire and a flange portion attached to the core portion supporting at least a second portion of the wire. The device has at least one hole with a first opening in the first surface defined by a first rim and a second opening in the second surface defined by a second rim. The hole allows the wire to pass through and also supports the wire. The hole is oriented in three dimensions to forestall a bend that may occur in the wire having a bend radius that is less than the minimum tolerable bend radius of the wire.Type: ApplicationFiled: April 30, 2010Publication date: November 3, 2011Applicant: Honeywell International Inc.Inventors: Gene Holden, Jacob Harding