Patents by Inventor Jacob Harding

Jacob Harding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10855677
    Abstract: The application describes an authentication process that incorporates voice commands with an HTTP interface module to perform a multifactor authentication (MFA) process. For example, a first computer system may initiate the MFA process by sending, with a HTTP interface module maintained by the first computer system, a request to initiate the MFA process to the second computer system. The MFA process may also transmit an one-time password (OTP) to a first user device. The first computer system may receive an audible recitation of the OTP from a second user device. The OTP may be parsed and used to generate an HTTP request. The HTTP interface module may send the HTTP request to the second computer system. When the second computer system authenticates the user based at least in part on the non-audible file, the first computer system may receive confirmation of authentication of the user to initiate the transaction.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: December 1, 2020
    Assignee: Amazon Technologies, Inc.
    Inventors: Aravindhan Vijayaraghavan, Sudheer Reddy Battula, Kumar Brahnmath, Thomas Haider, Jacob Harding, Ram Kakkad, Rishikesan Rangarajan
  • Publication number: 20200177581
    Abstract: The application describes an authentication process that incorporates voice commands with an HTTP interface module to perform a multifactor authentication (MFA) process. For example, a first computer system may initiate the MFA process by sending, with a HTTP interface module maintained by the first computer system, a request to initiate the MFA process to the second computer system. The MFA process may also transmit an one-time password (OTP) to a first user device. The first computer system may receive an audible recitation of the OTP from a second user device. The OTP may be parsed and used to generate an HTTP request. The HTTP interface module may send the HTTP request to the second computer system. When the second computer system authenticates the user based at least in part on the non-audible file, the first computer system may receive confirmation of authentication of the user to initiate the transaction.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 4, 2020
    Inventors: Aravindhan Vijayaraghavan, Sudheer Reddy Battula, Kumar Brahnmath, Thomas Haider, Jacob Harding, Ram Kakkad, Rishikesan Rangarajan
  • Patent number: 9576719
    Abstract: Embodiments of an electromagnetic coil assembly are provided, as are methods for the manufacture of an electromagnetic coil assembly. In one embodiment, the method for manufacturing an electromagnetic coil assembly includes the steps of providing a braided aluminum lead wire having a first end portion and a second end portion, brazing the first end portion of the braided aluminum lead wire to a first electrically-conductive interconnect member, and winding a magnet wire into an electromagnetic coil. The second end portion of the braided aluminum lead wire is joined to the magnet wire after the step of brazing.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: February 21, 2017
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Robert Franconi, Jacob Harding, Jimmy Wiggins, Eric Passman, Richard Fox
  • Patent number: 9508486
    Abstract: Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the high temperature electromagnetic coil assembly includes a coiled anodized aluminum wire and an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded. The electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: November 29, 2016
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Eric Passman, Reza Oboodi, Robert Franconi, Richard Fox, Gary J. Seminara, Gene Holden, Jacob Harding
  • Publication number: 20160072268
    Abstract: Methods and devices are provided for supporting a wire having a minimum tolerable bend radius. The device comprises a core portion with a longitudinal axis supporting at least a first portion of the wire and a flange portion attached to the core portion supporting at least a second portion of the wire. The device has at least one hole with a first opening in the first surface defined by a first rim and a second opening in the second surface defined by a second rim. The hole allows the wire to pass through and also supports the wire. The hole is oriented in three dimensions to forestall a bend that may occur in the wire having a bend radius that is less than the minimum tolerable bend radius of the wire.
    Type: Application
    Filed: November 13, 2015
    Publication date: March 10, 2016
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Gene Holden, Jacob Harding
  • Patent number: 9203228
    Abstract: Methods and devices are provided for supporting a wire having a minimum tolerable bend radius. The device comprises a core portion with a longitudinal axis supporting at least a first portion of the wire and a flange portion attached to the core portion supporting at least a second portion of the wire. The device has at least one hole with a first opening in the first surface defined by a first rim and a second opening in the second surface defined by a second rim. The hole allows the wire to pass through and also supports the wire. The hole is oriented in three dimensions to forestall a bend that may occur in the wire having a bend radius that is less than the minimum tolerable bend radius of the wire.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: December 1, 2015
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Gene Holden, Jacob Harding
  • Publication number: 20150287522
    Abstract: Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the high temperature electromagnetic coil assembly includes a coiled anodized aluminum wire and an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded. The electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire.
    Type: Application
    Filed: September 24, 2013
    Publication date: October 8, 2015
    Inventors: James Piascik, Eric Passman, Reza Oboodi, Robert Franconi, Richard Fox, Gary J. Seminara, Gene Holden, Jacob Harding
  • Publication number: 20150287518
    Abstract: Embodiments of an electromagnetic coil assembly are provided, as are methods for the manufacture of an electromagnetic coil assembly. In one embodiment, the method for manufacturing an electromagnetic coil assembly includes the steps of providing a braided aluminum lead wire having a first end portion and a second end portion, brazing the first end portion of the braided aluminum lead wire to a first electrically-conductive interconnect member, and winding a magnet wire into an electromagnetic coil. The second end portion of the braided aluminum lead wire is joined to the magnet wire after the step of brazing.
    Type: Application
    Filed: June 17, 2015
    Publication date: October 8, 2015
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Robert Franconi, Jacob Harding, Jimmy Wiggins, Eric Passman, Richard Fox
  • Patent number: 9076581
    Abstract: By way of example, a method for manufacturing an electromagnetic coil assembly includes the steps of providing a braided aluminum lead wire having a first end portion and a second end portion, brazing the first end portion of the braided aluminum lead wire to a first electrically-conductive interconnect member, and winding a magnet wire into an electromagnetic coil. The second end portion of the braided aluminum lead wire is joined to the magnet wire after the step of brazing.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: July 7, 2015
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Robert Franconi, Jacob Harding, Jimmy Wiggins, Eric Passman, Richard Fox
  • Patent number: 8994486
    Abstract: Embodiments of a method are provided for joining a secondary wire to a magnet wire, such as a fine gauge aluminum or silver wire. Further provided are embodiments of a disparate wire splice connector and embodiments of an electromagnetic coil assembly including such a splice connector. In one embodiment, the electromagnetic coil assembly includes disparate wire splice connector having a first blind bore and a second blind bore. A coiled magnet wire having a segment inserted into the first blind bore is soldered to the disparate wire splice connector. A secondary wire having a segment inserted into the second blind bore is also soldered to the disparate wire splice connector such that the secondary wire is electrically coupled to the coiled magnet wire through the disparate wire splice connector.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: March 31, 2015
    Assignee: Honeywell International Inc.
    Inventors: Gene Holden, Jacob Harding
  • Patent number: 8754735
    Abstract: Embodiments of an electromagnetic coil assembly are provided, as are methods for the manufacture of an electromagnetic coil assembly. In one embodiment, the electromagnetic coil assembly includes coiled magnet wire and a braided lead wire, which has a first end segment electrically coupled to the coiled magnet wire and having a second end segment. The electromagnetic coil assembly further includes an electrically-conductive member to which the second end segment of the braided lead wire is crimped.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: June 17, 2014
    Assignee: Honeywell International Inc.
    Inventors: James Piascik, Jacob Harding, Eric Passman, Robert Franconi, Richard Fox
  • Patent number: 8572838
    Abstract: Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the method includes the steps of applying a high thermal expansion ceramic coating over an anodized aluminum wire, coiling the coated anodized aluminum wire around a support structure, and curing the high thermal expansion ceramic coating after coiling to produce an electrically insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: November 5, 2013
    Assignee: Honeywell International Inc.
    Inventors: James Piascik, Eric Passman, Reza Oboodi, Robert Franconi, Richard Fox, Gary J. Seminara, Gene Holden, Jacob Harding
  • Publication number: 20130285777
    Abstract: Embodiments of an electromagnetic coil assembly are provided, as are methods for the manufacture of an electromagnetic coil assembly. In one embodiment, the electromagnetic coil assembly includes coiled magnet wire and a braided lead wire, which has a first end segment electrically coupled to the coiled magnet wire and having a second end segment. The electromagnetic coil assembly further includes an electrically-conductive member to which the second end segment of the braided lead wire is crimped.
    Type: Application
    Filed: April 30, 2012
    Publication date: October 31, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Jacob Harding, Eric Passman, Robert Franconi, Richard Fox
  • Publication number: 20130285776
    Abstract: Embodiments of an electromagnetic coil assembly are provided, as are methods for the manufacture of an electromagnetic coil assembly. In one embodiment, the method for manufacturing an electromagnetic coil assembly includes the steps of providing a braided aluminum lead wire having a first end portion and a second end portion, brazing the first end portion of the braided aluminum lead wire to a first electrically-conductive interconnect member, and winding a magnet wire into an electromagnetic coil. The second end portion of the braided aluminum lead wire is joined to the magnet wire after the step of brazing.
    Type: Application
    Filed: April 30, 2012
    Publication date: October 31, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Robert Franconi, Jacob Harding, Jimmy Wiggins, Eric Passman, Richard Fox
  • Publication number: 20130082809
    Abstract: Embodiments of a method are provided for joining a secondary wire to a magnet wire, such as a fine gauge aluminum or silver wire. Further provided are embodiments of a disparate wire splice connector and embodiments of an electromagnetic coil assembly including such a splice connector. In one embodiment, the electromagnetic coil assembly includes disparate wire splice connector having a first blind bore and a second blind bore. A coiled magnet wire having a segment inserted into the first blind bore is soldered to the disparate wire splice connector. A secondary wire having a segment inserted into the second blind bore is also soldered to the disparate wire splice connector such that the secondary wire is electrically coupled to the coiled magnet wire through the disparate wire splice connector.
    Type: Application
    Filed: June 11, 2012
    Publication date: April 4, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Gene Holden, Jacob Harding
  • Publication number: 20120225784
    Abstract: Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the method includes the steps of applying a high thermal expansion ceramic coating over an anodized aluminum wire, coiling the coated anodized aluminum wire around a support structure, and curing the high thermal expansion ceramic coating after coiling to produce an electrically insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded.
    Type: Application
    Filed: March 2, 2011
    Publication date: September 6, 2012
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Eric Passman, Reza Oboodi, Robert Franconi, Richard Fox, Gary J Seminara, Gene Holden, Jacob Harding
  • Patent number: 8205786
    Abstract: Embodiments of a method are provided for joining an aluminum wire to a secondary wire, as are embodiments of an aluminum wire splice connector and embodiments of an electromagnetic coil assembly including an aluminum wire splice connector. In one embodiment, the method includes the steps providing a splice connector having a first blind bore and a second blind bore, inserting a segment of a coiled aluminum magnet wire into the first blind bore, and inserting a segment of the secondary wire into the second blind bore. The splice connector is soldered to the segments of the aluminum wire and the secondary wire inserted into the first and second blind bores, respectively, to electrically couple the coiled aluminum magnet wire and the secondary wire through the splice connector.
    Type: Grant
    Filed: October 3, 2011
    Date of Patent: June 26, 2012
    Assignee: Honeywell International Inc.
    Inventors: Gene Holden, Jacob Harding
  • Publication number: 20110266401
    Abstract: Methods and devices are provided for supporting a wire having a minimum tolerable bend radius. The device comprises a core portion with a longitudinal axis supporting at least a first portion of the wire and a flange portion attached to the core portion supporting at least a second portion of the wire. The device has at least one hole with a first opening in the first surface defined by a first rim and a second opening in the second surface defined by a second rim. The hole allows the wire to pass through and also supports the wire. The hole is oriented in three dimensions to forestall a bend that may occur in the wire having a bend radius that is less than the minimum tolerable bend radius of the wire.
    Type: Application
    Filed: April 30, 2010
    Publication date: November 3, 2011
    Applicant: Honeywell International Inc.
    Inventors: Gene Holden, Jacob Harding