Patents by Inventor Jacob HEIER

Jacob HEIER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NOVEL ELECTRONIC DEVICE AND METHOD FOR PRODUCING LAYERS OF THE SAME
    Publication number: 20210225597
    Abstract: The present invention concerns a method for producing layers of an electronic device and to a method for producing electronic devices. The method comprises co-firing a plurality of different overlapping or superposed films comprising metal oxides, precursors of the aforementioned and/or carbon, in addition to organic components. The method renders the manufacturing process of such electronic devices more efficient.
    Type: Application
    Filed: May 17, 2019
    Publication date: July 22, 2021
    Inventors: Anand Verma, David Martineau, Frank Nuesch, Jacob Heier, Tobias Meyer
  • Novel Electronic Device and Method for Slot-Die Depositing Layers of the Same
    Publication number: 20210210685
    Abstract: The present invention concerns a method for deposition layers of an electronic device by slot-die deposition. Preferably, the method comprises slot-die deposition of formulation for providing compact inorganic layers, mesoporous inorganic layers, a carbon layer and a layer comprising organic-inorganic perovskite. In a preferred embodiment, the layers of a monolithic perovskite solar cell are entirely deposited by slot-die deposition. The method renders the manufacturing process of such electronic devices more efficient.
    Type: Application
    Filed: May 17, 2019
    Publication date: July 8, 2021
    Applicants: EMPA EIDGENÖSSISCHE MATERIALPRÜFUNGS- UND FORSCHUNGSANSTALT, SOLARONIX S.A.
    Inventors: Anand VERMA, David MARTINEAU, Frank NÜESCH, Jacob HEIER, Tobias MEYER