Abstract: A wafer probe station system for reliability testing of a semiconductor wafer. The wafer probe station is capable of interfacing with interchangeable modules for testing of semiconductor wafers. The wafer probe station can be used with different interchangeable modules for wafer testing. Modules, such as probe card positioners and air-cooled rail systems, for example, can be mounted or docked to the probe station. The wafer probe station is also provided with a front loading mechanism having a rotatable arm that rotates at least partially out of the probe station chamber for wafer loading.

Abstract: A wafer probe station system for reliability testing of a semiconductor wafer. The wafer probe station is capable of interfacing with interchangeable modules for testing of semiconductor wafers. The wafer probe station can be used with different interchangeable modules for wafer testing. Modules, such as probe card positioners and air-cooled rail systems, for example, can be mounted or docked to the probe station. The wafer probe station is also provided with a front loading mechanism having a rotatable arm that rotates at least partially out of the probe station chamber for wafer loading.

Abstract: A wafer probe station system for reliability testing of a semiconductor wafer. The wafer probe station is capable of interfacing with interchangeable modules for testing of semiconductor wafers. The wafer probe station can be used with different interchangeable modules for wafer testing. Modules, such as probe card positioners and air-cooled rail systems, for example, can be mounted or docked to the probe station. The wafer probe station is also provided with a front loading mechanism having a rotatable arm that rotates at least partially out of the probe station chamber for wafer loading.

Abstract: In accordance with an aspect, a thermally-controllable integrated unit is configured to hold devices under test. The integrated unit includes at least one heater board, comprised of a thermally-conductive material and provided with at least one global heater configured to globally heat the DUT board. A DUT board of the integrated unit includes a DUT board in thermal contact with the at least one heater board, the DUT board including a plurality of sockets, each socket configured to hold at least one DUT. The DUT has conductor paths to conduct electrical signals between test equipment and the terminals of DUTs in the sockets. Each socket includes an associated temperature sensor and a separately controllable local heater configured to, based on a temperature indication from the temperature sensor, heat a DUT in that socket.

Abstract: In accordance with an aspect, a thermally-controllable integrated unit is configured to hold devices under test. The integrated unit includes at least one heater board, comprised of a thermally-conductive material and provided with at least one global heater configured to globally heat the DUT board. A DUT board of the integrated unit includes a DUT board in thermal contact with the at least one heater board, the DUT board including a plurality of sockets, each socket configured to hold at least one DUT. The DUT has conductor paths to conduct electrical signals between test equipment and the terminals of DUTs in the sockets. Each socket includes an associated temperature sensor and a separately controllable local heater configured to, based on a temperature indication from the temperature sensor, heat a DUT in that socket.

Abstract: A strip-shaped package is provided that can accept a single die up to many dice. Conduction paths are printed (or otherwise integrally formed) thereon to the edge of the package, and a complementary socket may be provided that, in combination with the strip-shaped package, provides for electrical connection to test electronics without the use of package leads. The strip-shaped package may be made of ceramic or other temperature resistant material. The strip-shaped package may have at least one “well” location in which the die or dice may be affixed to the strip-shaped package. The strip may have notches configured to function as separators between the individual die housings (and related integrally-formed conduction paths).