Patents by Inventor Jacob Horowitz

Jacob Horowitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4996046
    Abstract: Psoriasis is treated with an infrared absorbing compound, preferably but not exclusively by occluding psoriatic lesions with a plastic film containing at least one compound which strongly absorbs infrared radiation in the range of from about 700 to about 1400 nanometers. The invention also includes a dressing for treating psoriasis incorporating one or more infrared blocking compounds. The infrared absorbing materials are preferably but not necessarily dispersed uniformly through a flexible carrier transparent to visible light, such as polyvinyl chloride (PVC) film or poly (methyl methacrylate) (PMMA) film, by known techniques of solution casting or dying. The materials can be used as the sole therapeutic agent, or as an adjunct to local and/or systemic treatments for psoriasis.
    Type: Grant
    Filed: November 24, 1989
    Date of Patent: February 26, 1991
    Inventors: Thelma G. Warshaw, Jacob Horowitz
  • Patent number: 4090009
    Abstract: Compositions useful for making electrical conductor patterns on a nonconductive substrate, the compositions comprising finely divided Pd/Ag and inorganic binder. The binder is free of bismuth oxide to reduce staining at conductor/resistor interfaces, and comprises certain proportions of glass, copper oxide, and pyrochlore-related oxide (lead ruthenate and/or copper bismuth ruthenate); lead oxide is optional. Despite the absence of bismuth oxide, aged adhesion is good, as is solder acceptance.
    Type: Grant
    Filed: March 11, 1977
    Date of Patent: May 16, 1978
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Samuel Jacob Horowitz
  • Patent number: 4001146
    Abstract: Compositions useful for making electrical conductor patterns on a nonconductive substrate, the compositions comprising metal powder and 1-5% glass-free inorganic binder. The binder consists essentially of certain amounts of bismuth oxide and oxides of copper and/or lead, and optionally MnB.sub.2 and/or MnO.sub.2. The metal powder is either silver or a mixture of silver with a second metal powder; the second metal powder is Pt, Pd, Au, or an alloy of Cu with one or more of Pt, Pd, Au, and Ag. The weight ratio of Ag to other metals is at least 17/1. These compositions are useful for making conductor patterns on substrates, which patterns have good adhesion to the substrate, both initially and after thermal aging (e.g., 150.degree. C. for 48 hours).
    Type: Grant
    Filed: February 26, 1975
    Date of Patent: January 4, 1977
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Samuel Jacob Horowitz