Abstract: After transmitting first electrical signals to a receiver, a transmitter receives a burst absent mode signal from the receiver. While in a ready state, the transmitter receives a signal including a data burst, converts the signal to second electrical signals, including a settled DC offset, and transmits the second electrical signals to the receiver. The receiver transmits the burst absent mode signal to the transmitter after receiving the first electrical signals, detects a presence of the second electrical signals. In response to detecting the presence of the second electrical signals, the receiver removes the DC offset from the second electrical signals to generate output signals, and causes transmitting the output signals to a subsequent device. The receiver removes the DC offset by causing an instruction to discharge AC coupling capacitors. The burst absent mode signal is generated using a host reset instruction or an internally generated instruction.

Abstract: A packaged optical receiver, comprising: a photodiode configured to receive an optical signal; a transimpedance amplifier (TIA) coupled to the photodiode; and a signal pin; wherein the optical receiver is configured to receive, via the signal pin, a reset signal; and wherein the optical receiver is configured to output in response to the reset signal, via the signal pin, a received signal strength indication (RSSI) for the received optical signal.

Abstract: After transmitting first electrical signals to a receiver, a transmitter receives a burst absent mode signal from the receiver. While in a ready state, the transmitter receives a signal including a data burst, converts the signal to second electrical signals, including a settled DC offset, and transmits the second electrical signals to the receiver. The receiver transmits the burst absent mode signal to the transmitter after receiving the first electrical signals, detects a presence of the second electrical signals. In response to detecting the presence of the second electrical signals, the receiver removes the DC offset from the second electrical signals to generate output signals, and causes transmitting the output signals to a subsequent device. The receiver removes the DC offset by causing an instruction to discharge AC coupling capacitors. The burst absent mode signal is generated using a host reset instruction or an internally generated instruction.

Abstract: A packaged optical receiver, comprising: a photodiode configured to receive an optical signal; a transimpedance amplifier (TIA) coupled to the photodiode; and a signal pin; wherein the optical receiver is configured to receive, via the signal pin, a reset signal; and wherein the optical receiver is configured to output in response to the reset signal, via the signal pin, a received signal strength indication (RSSI) for the received optical signal.

Abstract: A test station and method of testing a design under test are disclosed. One method includes applying a first test frequency signal to a reference path to determine a first known attenuation level, and applying the first test frequency signal to a design under test to determine a first tested attenuation level of the design under test at the first test frequency. The method also includes applying a second test frequency signal to the reference path to determine a second known attenuation level, and applying the second test frequency signal to the design under test to determine a second tested attenuation level of the design under test at the second test frequency. The method includes determining whether the design under test is faulty based on the first tested attenuation level and the second tested attenuation level.

Abstract: A test station and method of testing a design under test are disclosed. One method includes applying a first test frequency signal to a reference path to determine a first known attenuation level, and applying the first test frequency signal to a design under test to determine a first tested attenuation level of the design under test at the first test frequency. The method also includes applying a second test frequency signal to the reference path to determine a second known attenuation level, and applying the second test frequency signal to the design under test to determine a second tested attenuation level of the design under test at the second test frequency. The method includes determining whether the design under test is faulty based on the first tested attenuation level and the second tested attenuation level.