Patents by Inventor Jacob Modjeski

Jacob Modjeski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONICS PACKAGING FOR MOVING PLATFORMS
    Publication number: 20230328888
    Abstract: In accordance with at least one aspect of this disclosure, a system includes one or more electronics boards and one or more plates configured to interleave the one or more electronics boards in a stack along an axis. When in the stack, an outer surface of the one or more plates is configured to form an outer mold line of a portion of a moving platform. Each of the one or more plates includes an inner diameter and an outer diameter, where the outer surface has an outer circumference at the outer diameter.
    Type: Application
    Filed: March 27, 2022
    Publication date: October 12, 2023
    Inventors: Gary Willenbring, Jason Graham, Neal R. Whatcott, Jacob Modjeski