Abstract: A method for producing reactive fine particles, includes: admixing at least one latent curing agent selected from the group consisting of a urea derivative, an imidazole, a dicyaniamide (DICY), a mixture of any one or more thereof, and a precursor thereof, in a solvent to form a clear solution; spraying the clear solution onto at least one inorganic inert particle selected from the group consisting of a metal oxide, a mineral filler, a natural filler, and a mixture of any one or more thereof, the at least one inorganic inert particle having a specific surface area in the range of about 10 to about 50 m2/g; and removing the solvent to form reactive fine particles that includes a core of inert material coated by a coating layer that includes the at least one latent curing agent.

Abstract: A reactive fine particle includes one or more functional compounds A or its precursors having a maximal size of less than 2 microns, adapted for synthesis, modification, curing, cross-linking, secession and/or initiating of polymerization of polymers; and one or more inert particles B having at least the maximal size of 2 microns and carrying said functional compounds A at its outer surface and/or in its inner portion. The compounds A to inert particles B weight ratio is ranging from 0.01A:100B to 50A:100B.

Abstract: A reactive fine particle includes one or more functional compounds A or its precursors having a maximal size of less than 2 microns, adapted for synthesis, modification, curing, cross-linking, secession and/or initiating of polymerization of polymers; and one or more inert particles B having at least the maximal size of 2 microns and carrying said functional compounds A at its outer surface and/or in its inner portion. The compounds A to inert particles B weight ratio is ranging from 0.01A:100B to 50A:100B.

Abstract: A method and apparatus for applying ink, according to a soldermask pattern, to a printed circuit board having elevated pads defining pad edges, the method including flooding the printed circuit board with ink such that the ink advances to the pad edges and is stopped thereby and thereat, without climbing onto the elevated pads.

Abstract: Liquid thermosetting ink for ink-jet applications includes at least a resin, at least one solid latent curing agent having a maximal particle size of less than 2 microns and an inert filler having fine particles. The single-pack or two-pack ink has a viscosity lower than 50 Cp at the application temperature, a surface tension lower than 80 dyn/cm at the application temperature, and a glass transition temperature of cured ink of greater than 120° C.

Abstract: A reactive fine particle includes one or more functional compounds A or its precursors having a maximal size of less than 2 microns, adapted for synthesis, modification, curing, cross-linking, secession and/or initiating of polymerization of polymers; and one or more inert particles B having at least the maximal size of 2 microns and carrying said functional compounds A at its outer surface and/or in its inner portion. The compounds A to inert particles B weight ratio is ranging from 0.01A:100B to 50A:100B.

Abstract: A method and apparatus for applying ink, according to a soldermask pattern, to a printed circuit board having elevated pads defining pad edges, the method including flooding the printed circuit board with ink such that the ink advances to the pad edges and is stopped thereby and thereat, without climbing onto the elevated pads.

Abstract: Liquid thermosetting ink for ink-jet applications includes at least a resin, at least one solid latent curing agent having a maximal particle size of less than 2 microns and an inert filler having fine particles. The single-pack or two-pack ink has a viscosity lower than 50 Cp at the application temperature, a surface tension lower than 80 dyn/cm at the application temperature, and a glass transition temperature of cured ink of greater than 120° C.

Abstract: A reactive fine particle includes one or more functional compounds A or its precursors having a maximal size of less than 2 microns, adapted for synthesis, modification, curing, cross-linking, secession and/or initiating of polymerization of polymers; and one or more inert particles B having at least the maximal size of 2 microns and carrying said functional compounds A at its outer surface and/or in its inner portion. The compounds A to inert particles B weight ratio is ranging from 0.01A:100B to 50A:100B.