Patents by Inventor Jacob N. Dekker

Jacob N. Dekker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of severing a plate of brittle material
    Patent number: 5084604
    Abstract: The invention relates to a method of asymmetrically severing a plate (3) of brittle material, in which by means of a heat source (5) a thermal load is provided along a heating track asymmetrically with respect to the desired cutting line (7) and the plate (3) is severed along the desired cutting line (7).
    Type: Grant
    Filed: May 7, 1990
    Date of Patent: January 28, 1992
    Assignee: U.S. Philips Corporation
    Inventors: Jacob N. Dekker, Maarten H. Zonneveld, Ireneus H. T. Fierkens, Theodorus J. M. J. van Gennip, Peter L. Holster