Abstract: An actively cooled system includes a heat generating device and at least one heat transfer device. The heat transfer device includes a refrigerant loop including a compressor for providing a superheated vapor state from a vapor stream, a condenser comprising a membrane coupled to an actuator, the condenser including a condensing surface for condensing the superheated vapor into a plurality of droplets, and an evaporator for receiving the droplets. An expansion structure is interposed between the condenser and the evaporator, wherein the membrane ejects the plurality of droplets toward the evaporator during refrigerant cycle intervals when the expansion structure is open. At least a portion of the heat generating device is in thermal contact with the evaporator.

Abstract: An actively cooled system includes a heat generating device and at least one heat transfer device. The heat transfer device includes a refrigerant loop including a compressor for providing a superheated vapor state from a vapor stream, a condenser comprising a membrane coupled to an actuator, the condenser including a condensing surface for condensing the superheated vapor into a plurality of droplets, and an evaporator for receiving the droplets. An expansion structure is interposed between the condenser and the evaporator, wherein the membrane ejects the plurality of droplets toward the evaporator during refrigerant cycle intervals when the expansion structure is open. At least a portion of the heat generating device is in thermal contact with the evaporator.

Abstract: A miniature vapor compression cycle thermal management device includes a dropwise condenser and ejector. The device includes a flexible compressor membrane serving as the compressor. The compressor can be stimulated electrostatically and drives refrigerant charge through a closed loop defined by interconnected compressor, condenser, expansion, and evaporator structures. The condenser includes a flexible condensing membrane for dropwise condensation and for propelling condensed droplets of refrigerant from a cooled condensing surface into an expansion chamber. The overall structure and size of the device is similar to microelectronic packages, and it may be combined to operate with similar devices in useful arrays.

Abstract: A miniature vapor compression cycle thermal management device with a dropwise condenser. The device of the invention includes a flexible compressor diaphragm serving as the compressive member in a compressor. The compressor is stimulated electrostatically and drives the relatively small refrigerant charge for the device through a closed loop defined by interconnected compressor, condenser, expansion, and evaporator structures. The condenser includes a flexible condenser diaphragm for propelling condensed droplets of refrigerant from a cooled condensing surface into an expansion chamber. The overall structure and size of the device is similar to microelectronic packages, and it may be combined to operate with similar devices in useful arrays. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure.