Patents by Inventor Jacob Nicola

Jacob Nicola has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240079530
    Abstract: Embodiments of an integrated circuit (IC) package are disclosed. In some embodiments, the IC package includes a semiconductor die, a glass substrate, and a package substrate. The semiconductor die includes a micro light emitting diode (LED). The semiconductor die is at least partially embedded within the glass substrate and the glass substrate including a through glass via (TGV) embedded in the glass substrate wherein the TGV is electrically coupled to the semiconductor die to provide power to the micro LED. The package substrate that is coupled to the TGV.
    Type: Application
    Filed: September 6, 2022
    Publication date: March 7, 2024
    Inventors: Jacob VEHONSKY, Onur OZKAN, Vinith BEJUGAM, Mao-Feng TSENG, Nicholas HAEHN, Andrea NICOLAS FLORES, Ali LEHAF, Benjamin DUONG, Joshua STACEY
  • Publication number: 20240079259
    Abstract: The present disclosure is directed to a system that uses a dual surface substrate carrier that includes a first transparent support with a first top surface and first bottom surface, a second transparent support with a second top surface and second bottom surface, and a reflective film positioned between and attached to the first transparent support and the second transparent support. The first transparent support has a first set of trenches configured in the first top surface that form a first set of ridges between the plurality of trenches and the second transparent support has a second set of trenches configured in the second top surface that form a second set of ridges between the plurality of trenches. The first transparent support is also configured with a first build surface and the second transparent support is also configured with a second build surface that are platforms for building package substrates.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 7, 2024
    Inventors: Jacob VEHONSKY, Onur OZKAN, Vinith BEJUGAM, Mao-Feng TSENG, Andrea NICOLAS, Nicholas HAEHN
  • Patent number: 11648479
    Abstract: A computer-implemented method of playing a game includes receiving, at a user computing device, an image and a hint from a location remote to the user across a network, displaying the image and the hint on a user interface of the user computing device, receiving, from a user input device on the user computing device, a guess from a user, transmitting the guess from the user computing device across the network to a server, receiving, from the server, an indication of a correctness of the guess at the user computing device, and repeating the receiving, transmitting and receiving from the server until a predetermined limit expires or a guess having a correctness of a particular type is received.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: May 16, 2023
    Inventor: Jacob Nicola
  • Publication number: 20210394070
    Abstract: A computer-implemented method of playing a game includes receiving, at a user computing device, an image and a hint from a location remote to the user across a network, displaying the image and the hint on a user interface of the user computing device, receiving, from a user input device on the user computing device, a guess from a user, transmitting the guess from the user computing device across the network to a server, receiving, from the server, an indication of a correctness of the guess at the user computing device, and repeating the receiving, transmitting and receiving from the server until a predetermined limit expires or a guess having a correctness of a particular type is received.
    Type: Application
    Filed: June 15, 2021
    Publication date: December 23, 2021
    Inventor: Jacob Nicola