Patents by Inventor Jacob P. Podkaminer

Jacob P. Podkaminer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250091320
    Abstract: Articles are described comprising a first substrate and a second substrate. At least one adhesive layer is disposed between the first and second substrates. The article further comprises a multilayer film within at least a portion of the adhesive layer(s). Also described is a method of disassembly comprising providing an adhesively bonded article as described herein; and separating the first substrate from the second substrate by delaminating the (e.g. multilayer) film. In other embodiments, adhesive articles (e.g. tape) are described comprising a (e.g. multilayer) film and methods of making adhesively bonded articles that comprise a (e.g. multilayer) film. Also described are methods of reworking, repairing, repurposing, or recycling an article, and articles.
    Type: Application
    Filed: December 3, 2024
    Publication date: March 20, 2025
    Inventors: Matthew H. Frey, Jacob P. Podkaminer, Ashley J. Smith, Stephen A. Johnson, Christoph Kuesters, Zhou Jin, Yunshu Zhang, Matthew T. Johnson, Luis E. Sotelo Martin, William T. Fay, Jason C. Anderson, Joseph J. Benson
  • Patent number: 12115737
    Abstract: The present disclosure provides a thermally conductive article including a pad having first and second opposed major surfaces and a thickness therebetween. The thickness is formed of entangled thermally conductive fibers and at least a portion of the entangled thermally conductive fibers have at least one terminal end at the first opposed major surface, the opposed second major surface, or both. The pad is at least partially impregnated with a polymer. Another thermally conductive article is provided including a) a pad having first and second opposed major surfaces and a thickness therebetween; b) a first thermally conductive skin layer; and c) a second thermally conductive skin layer. The thickness of the pad is formed of aligned thermally conductive fibers, and at least a portion of the thermally conductive fibers have a terminal end at the first opposed major surface and the opposed second major surface.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: October 15, 2024
    Assignee: 3M Innovative Properties Company
    Inventors: Jacob P. Podkaminer, Jens Eichler, Peter J. Schneider, Sebastian Goris, Victor Ho, Joseph A. Dunbar, Matthew T. Johnson, Matthew H. Frey
  • Publication number: 20240239991
    Abstract: A shaped thermal filler particle has an elongate shape defined by a substantially planar first smooth surface and a second smooth surface that contacts the substantially planar first smooth surface along a planar closed path. The planar closed path has a length to width ratio of at least 1.5. The shaped thermal filler particle has a maximum linear dimension normal to the planar first smooth surface that is less than or equal to one half of the length of the closed path. A thermally conductive composition comprises from 1 to 95 percent by volume of the shaped thermal filler particles dispersed in a binder. An assembly comprises a heat source, a heat sink, and the thermally conductive composition at least partially sandwiched between the heat source and the heat sink.
    Type: Application
    Filed: July 22, 2021
    Publication date: July 18, 2024
    Inventors: Jacob P. Podkaminer, Matthew H. Frey, Victor Ho, Matthew T. Johnson, Jeremy K. Larsen, Craig W. Lindsay, Kyle C. Picha, Mario A. Perez
  • Publication number: 20230339194
    Abstract: The present disclosure provides a thermally conductive article including a pad having first and second opposed major surfaces and a thickness therebetween. The thickness is formed of entangled thermally conductive fibers and at least a portion of the entangled thermally conductive fibers have at least one terminal end at the first opposed major surface, the opposed second major surface, or both. The pad is at least partially impregnated with a polymer. Another thermally conductive article is provided including a) a pad having first and second opposed major surfaces and a thickness therebetween; b) a first thermally conductive skin layer; and c) a second thermally conductive skin layer. The thickness of the pad is formed of aligned thermally conductive fibers, and at least a portion of the thermally conductive fibers have a terminal end at the first opposed major surface and the opposed second major surface.
    Type: Application
    Filed: February 18, 2021
    Publication date: October 26, 2023
    Inventors: Jacob P. Podkaminer, Jens Eichler, Peter J. Schneider, Sebastian Goris, Victor Ho, Joseph A. Dunbar, Matthew T. Johnson, Jay B. Preston, Matthew H. Frey, Eric L. Askeland, Steven D. Solomonson, Sung W. Moon, Michael P. Wald
  • Publication number: 20230323131
    Abstract: A decorated particle comprises a single inorganic particle core having an uneven outer surface with a plurality of crevices and an average particle diameter of 20 to 150 microns. A binder retaining decorating particles is disposed on at least a portion of the outer surface of the inorganic particle core and fills the crevices. The decorating particles have an average particle diameter of 0.05 to 10 microns. A method of making decorated particles is also disclosed.
    Type: Application
    Filed: September 3, 2021
    Publication date: October 12, 2023
    Inventors: Yongbeom Seo, Matthew H. Frey, Jacob P. Podkaminer, Victor Ho, Samuel J. Carpenter, Audrey S. Forticaux, Lalitha V. N. R. Ganapatibhotla, Taisiya Skorina, Jeremy M. Higgins, Yangbin Chen
  • Publication number: 20230299384
    Abstract: A thermal management assembly comprises an electrochemical cell, a heat sink, and a thermal pathway comprising a thermally interruptible interface interposed therebetween the electrochemical cell and the heat sink. The thermal pathway comprises an expandable material comprising intumescent particles. If heated to at least a first onset temperature, the expandable material expands and causes at least partial shear delamination at the first thermally interruptible interface. A composite thermal management article comprises a first layer comprising an expandable material comprising intumescent particles and a second layer comprising a thermal conductor material. The first and second layers contact each other at a thermally interruptible interface.
    Type: Application
    Filed: August 6, 2021
    Publication date: September 21, 2023
    Inventors: Victor Ho, Jacob P. Podkaminer, Matthew T. Johnson, Matthew H. Frey, Samuel J. Carpenter, Brandon A. Bartling
  • Publication number: 20230055151
    Abstract: A thermal interface layer includes pluralities of first and second particles dispersed in a polymeric binder at a total loading V in a range of about 40 volume percent to about 70 volume percent. The first and second particles have different compositions. The first particles include one or more of iron or nickel. The second particles include one or more of aluminum, magnesium, silicon, copper, or zinc. The thermal interface layer has a thermal conductivity in a thickness direction of the thermal interface layer in units of W/mK of at least K=5.1?0.17 V+0.002 V2.
    Type: Application
    Filed: January 14, 2021
    Publication date: February 23, 2023
    Inventors: Samuel J. Carpenter, Aaron K. Nienaber, Joseph B. Eckel, Ronald D. Jesme, Jacob P. Podkaminer, Victor Ho, Sebastian Goris, Matthew T. Johnson, Michael S. Graff, Steven H. Kong
  • Publication number: 20170167012
    Abstract: Thin film deposition systems with in situ, real-time RHEED monitoring of films deposited via off-axis magnetron sputtering are provided. Also provided are methods of using the systems to grow the films and methods to monitor their growth in real-time. Using the deposition systems, thin films of a sputtered material are grown and monitored in a single vacuum sputtering chamber that houses components of both the magnetron sputtering system and the RHEED system arranged about the substrate onto which the film is grown.
    Type: Application
    Filed: December 9, 2015
    Publication date: June 15, 2017
    Inventors: Chang-Beom Eom, Jacob P. Podkaminer, Jacob J. Patzner