Abstract: A release pad configured to receive an adhesive-backed label, wherein the release pad can comprise a debossed surface that can allow for the clean and easy removal of such labels. This release pad can be connected to any object to which attaching an adhesive-backed label is desired. In an embodiment, a pattern can be created on the debossed surface wherein the adhesion points between the pad and the label can be controlled. This pattern can be used to increase adhesion near the label's center and decrease adhesion at parts of the label farthest from its center. In an embodiment, the release pad can be attached to a reusable mailer allowing it to be used multiple times without a buildup of previously used labels.