Patents by Inventor Jacob Pretko

Jacob Pretko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High dielectric constant neat polymeric film
    Patent number: 12698370
    Abstract: A polymeric film and process for making same, the film comprising residues of 5(6)-amino-2-(p-aminophenyl) benzimidazole, aromatic diamine, and aromatic diacid-chloride, in the form of polymer having a polymer chain including a salt of formula I, wherein C+ is a sodium, potassium, or calcium cation, the film having a thickness of about 1 to 50 micrometers, and a dielectric constant of 4.5 or greater at 2 GHz in the absence of any particulate additives that increase the dielectric constant of the film.
    Type: Grant
    Filed: September 14, 2023
    Date of Patent: August 4, 2026
    Assignee: DUPONT SAFETY & CONSTRUCTION, INC.
    Inventors: Kathleen Opper, Christopher Seay, Kevin Kaurich, Jacob Pretko
  • COMPOSITE COMPOSITION COMPRISING ARAMID COPOLYMER PARTICLES AND A THERMOPLASTIC ENGINEERING POLYMER AND ARTICLES COMPRISING SAME
    Publication number: 20240301205
    Abstract: A composite composition, and process for making and article comprising same, the composition comprising 3 to 30 parts by weight particles comprising aramid copolymer including an imidazole group, and up to 97 parts by weight of a thermoplastic engineering polymer; wherein said particles are uniformly dispersed in the thermoplastic engineering polymer and reduce the wear rate of the thermoplastic engineering polymer by at least 25 percent.
    Type: Application
    Filed: May 10, 2024
    Publication date: September 12, 2024
    Inventors: Kathleen Opper, Kevin Kaurich, Teresa Madeleine, JACOB PRETKO
  • COMPOSITE COMPOSITION COMPRISING ARAMID COPOLYMER PARTICLES AND A THERMOPLASTIC ENGINEERING POLYMER AND ARTICLES COMPRISING SAME
    Publication number: 20240182713
    Abstract: A composite composition, and process for making and article comprising same, the composition comprising 3 to 30 parts by weight particles comprising aramid copolymer including an imidazole group, and up to 97 parts by weight of a thermoplastic engineering polymer; wherein said particles are uniformly dispersed in the thermoplastic engineering polymer and reduce the wear rate of the thermoplastic engineering polymer by at least 25 percent.
    Type: Application
    Filed: October 30, 2023
    Publication date: June 6, 2024
    Inventors: Kathleen Opper, Kevin Kaurich, Teresa Madeleine, Jacob Pretko
  • HIGH DIELECTRIC CONSTANT NEAT POLYMERIC FILM
    Publication number: 20240117131
    Abstract: A polymeric film and process for making same, the film comprising residues of 5(6)-amino-2-(p-aminophenyl) benzimidazole, aromatic diamine, and aromatic diacid-chloride, in the form of polymer having a polymer chain including a salt of formula I, wherein C+ is a sodium, potassium, or calcium cation, the film having a thickness of about 1 to 50 micrometers, and a dielectric constant of 4.5 or greater at 2 GHz in the absence of any particulate additives that increase the dielectric constant of the film.
    Type: Application
    Filed: September 14, 2023
    Publication date: April 11, 2024
    Inventors: Kathleen Opper, Christopher Seay, Kevin Kaurich, Jacob Pretko