Patents by Inventor Jacob Sanchez

Jacob Sanchez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250178278
    Abstract: A system includes a substrate having a textured support surface and a film layer having a first side contacting the textured support surface of the substrate and a second side formed on an opposite side from the first side. The system further includes a build surface contacting the second side of the film layer and operable between a first build surface position a first distance from the substrate and a second build surface position a second distance greater than the first distance from the substrate, wherein the first side of the film layer is attached to the substrate with the build surface at the first build surface position and the first side of the film layer is detached from the substrate with the build surface at the second build surface position.
    Type: Application
    Filed: February 3, 2025
    Publication date: June 5, 2025
    Applicant: Formlabs Inc.
    Inventors: Dmitri Megretski, Benjamin FrantzDale, Jacob Sanchez, Alec Rudd
  • Patent number: 12233600
    Abstract: A method includes curing a photopolymer resin disposed between a first build surface and a flexible film layer to form a print layer of a printed part. Here, the print layer of the printed part defines a second build surface attached to the flexible film layer. The method also includes translating a peeling mechanism between the second build surface and the flexible film layer to detach the flexible film layer from the second build surface.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: February 25, 2025
    Assignee: Formlabs Inc.
    Inventors: Dmitri Megretski, Benjamin FrantzDale, Jacob Sanchez, Alec Rudd
  • Publication number: 20230182390
    Abstract: A method includes curing a photopolymer resin disposed between a first build surface and a flexible film layer to form a print layer of a printed part. Here, the print layer of the printed part defines a second build surface attached to the flexible film layer. The method also includes translating a peeling mechanism between the second build surface and the flexible film layer to detach the flexible film layer from the second build surface.
    Type: Application
    Filed: December 7, 2022
    Publication date: June 15, 2023
    Applicant: Formlabs Inc.
    Inventors: Dmitri Megretski, Benjamin FrantzDale, Jacob Sanchez, Alec Rudd
  • Patent number: D809945
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: February 13, 2018
    Assignee: Helen of Troy Limited
    Inventors: Mark Prommel, Marco Perry, Pil Ho Chung, Jacob Sanchez, Adem Önalan, Matthew Dolph