Patents by Inventor Jacob Sanchez

Jacob Sanchez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12233600
    Abstract: A method includes curing a photopolymer resin disposed between a first build surface and a flexible film layer to form a print layer of a printed part. Here, the print layer of the printed part defines a second build surface attached to the flexible film layer. The method also includes translating a peeling mechanism between the second build surface and the flexible film layer to detach the flexible film layer from the second build surface.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: February 25, 2025
    Assignee: Formlabs Inc.
    Inventors: Dmitri Megretski, Benjamin FrantzDale, Jacob Sanchez, Alec Rudd
  • Publication number: 20230182390
    Abstract: A method includes curing a photopolymer resin disposed between a first build surface and a flexible film layer to form a print layer of a printed part. Here, the print layer of the printed part defines a second build surface attached to the flexible film layer. The method also includes translating a peeling mechanism between the second build surface and the flexible film layer to detach the flexible film layer from the second build surface.
    Type: Application
    Filed: December 7, 2022
    Publication date: June 15, 2023
    Applicant: Formlabs Inc.
    Inventors: Dmitri Megretski, Benjamin FrantzDale, Jacob Sanchez, Alec Rudd
  • Patent number: D809945
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: February 13, 2018
    Assignee: Helen of Troy Limited
    Inventors: Mark Prommel, Marco Perry, Pil Ho Chung, Jacob Sanchez, Adem Önalan, Matthew Dolph